Ossimitz; Peter

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ossimitz; Peter.The latest application filed is for "multi-level chip interconnect".

Company Profile

0.20.20

Ossimitz; Peter - Munich DE
OSSIMITZ; Peter - Muenchen DE
Ossimitz; Peter - Munchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor chip having a dense arrangement of contact terminals Grant 10,090,251 - Ossimitz , et al. October 2, 2	2018-10-02
Multi-level chip interconnect Grant 9,871,017 - Ossimitz , et al. January 16, 2	2018-01-16
Semiconductor device having a chip under package Grant 9,859,251 - Beer , et al. January 2, 2	2018-01-02
Multi-level Chip Interconnect App 20170194288 - OSSIMITZ; Peter ; et al.	2017-07-06
Circuitry and method for monitoring a power supply of an electronic device Grant 9,651,630 - Barrenscheen , et al. May 16, 2	2017-05-16
Semiconductor Chip Having a Dense Arrangement of Contact Terminals App 20170025357 - Ossimitz; Peter ; et al.	2017-01-26
Semiconductor Device Having a Chip Under Package App 20160225745 - Beer; Gottfried ; et al.	2016-08-04
Overmolded substrate-chip arrangement with heat sink Grant 9,385,059 - Ossimitz , et al. July 5, 2	2016-07-05
Chip package having terminal pads of different form factors Grant 9,362,187 - Ossimitz June 7, 2	2016-06-07
Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith Grant 9,299,673 - Ossimitz , et al. March 29, 2	2016-03-29
Chip arrangement, and method for forming a chip arrangement Grant 9,219,031 - Ossimitz , et al. December 22, 2	2015-12-22
Integrated IC package Grant 9,204,543 - Ossimitz December 1, 2	2015-12-01
Method of manufacturing and testing a chip package Grant 9,082,644 - Ossimitz , et al. July 14, 2	2015-07-14
Integrated Ic Package App 20150156872 - OSSIMITZ; Peter	2015-06-04
Overmolded substrate-chip arrangement with heat sink App 20150062825 - Ossimitz; Peter ; et al.	2015-03-05
Circuitry And Method For Monitoring A Power Supply Of An Electronic Device App 20150022924 - Barrenscheen; Jens ; et al.	2015-01-22
Chip Arrangement, And Method For Forming A Chip Arrangement App 20140332953 - Ossimitz; Peter ; et al.	2014-11-13
Semiconductor Chip, Method For Manufacturing A Semiconductor Chip, Device And Method For Manufacturing A Device App 20140264814 - Ossimitz; Peter ; et al.	2014-09-18
Semiconductor memory component having a diverting circuit Grant 8,799,704 - Ossimitz August 5, 2	2014-08-05
Chip Package Having Terminal Pads of Different Form Factors App 20140203278 - Ossimitz; Peter	2014-07-24
Method of Manufacturing and Testing a Chip Package App 20140206109 - Ossimitz; Peter ; et al.	2014-07-24
Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells Grant 8,779,577 - Ossimitz , et al. July 15, 2	2014-07-15
Semiconductor Chip, Method For Manufacturing A Semiconductor Chip, Device And Method For Manufacturing A Device App 20130207254 - Ossimitz; Peter ; et al.	2013-08-15
Device for releasably receiving a semiconductor chip Grant 8,399,265 - Ossimitz March 19, 2	2013-03-19
Device for Releasably Receiving a Semiconductor Chip App 20120238042 - Ossimitz; Peter	2012-09-20
Electronic element comprising an electronic circuit which is to be tested and test system arrangement which is used to test the electronic element Grant 7,640,469 - Arnold , et al. December 29, 2	2009-12-29
Rewiring substrate strip with several semiconductor component positions Grant 7,560,801 - Ossimitz July 14, 2	2009-07-14
Rewiring substrate strip having a plurality of semiconductor component positions Grant 7,501,701 - Ossimitz March 10, 2	2009-03-10
Semiconductor Memory Component Having A Diverting Circuit App 20080016391 - Ossimitz; Peter	2008-01-17
Rewiring Substrate Strip Having a Plurality of Semiconductor Component Positions App 20070063311 - Ossimitz; Peter	2007-03-22
Rewiring substrates strip with several semiconductor component positions App 20070051984 - Ossimitz; Peter	2007-03-08
Rewiring substrate strip with a number of semiconductor component positions Grant 7,154,116 - Gibson , et al. December 26, 2	2006-12-26
Electronic element comprising an electronic circuit which is to be tested and test system arrangement which is used to test the electronic element App 20060190792 - Arnold; Ralf ; et al.	2006-08-24
Multi-chip module and method for testing App 20050086564 - Frankowsky, Gerd ; et al.	2005-04-21
Rewiring substrate strip with a number of semiconductor component positions App 20050082667 - Gibson, Gavin ; et al.	2005-04-21
Apparatus and method for testing semiconductor nodules on a semiconductor substrate wafer App 20050006726 - Ossimitz, Peter	2005-01-13

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