Oshima; Toshiyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oshima; Toshiyuki.The latest application filed is for "semiconductor device, inverter circuit, driving device, vehicle, and elevator".

Company Profile

5.14.15

Oshima; Toshiyuki - Bunkyo JP
Oshima; Toshiyuki - Ibaraki JP
Oshima; Toshiyuki - Ibaraki-shi JP
Oshima; Toshiyuki - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device, inverter circuit, driving device, vehicle, and elevator Grant 11,276,751 - Kyogoku , et al. March 15, 2	2022-03-15
Semiconductor device, inverter circuit, driving device, vehicle, and elevator having a reduced on-resistance with a silicon carbide layer Grant 11,276,758 - Shimizu , et al. March 15, 2	2022-03-15
Semiconductor device, inverter circuit, driving device, vehicle, and elevator Grant 11,276,774 - Shimizu , et al. March 15, 2	2022-03-15
Semiconductor Device, Inverter Circuit, Driving Device, Vehicle, And Elevator App 20210043723 - KYOGOKU; Shinya ; et al.	2021-02-11
Semiconductor device, inverter circuit, driving device, vehicle, and elevator Grant 10,770,549 - Oshima , et al. Sep	2020-09-08
Semiconductor Device, Inverter Circuit, Driving Device, Vehicle, And Elevator App 20200220001 - SHIMIZU; Tatsuo ; et al.	2020-07-09
Semiconductor Device, Inverter Circuit, Driving Device, Vehicle, And Elevator App 20200219980 - SHIMIZU; Tatsuo ; et al.	2020-07-09
Semiconductor Device, Inverter Circuit, Driving Device, Vehicle, And Elevator App 20200035791 - OSHIMA; Toshiyuki ; et al.	2020-01-30
Heat-peelable pressure-sensitive adhesive sheet Grant 7,718,257 - Murata , et al. May 18, 2	2010-05-18
Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board App 20070111392 - Murata; Akihisa ; et al.	2007-05-17
Heat-peelable pressure-sensitive adhesive sheet Grant 7,214,424 - Kiuchi , et al. May 8, 2	2007-05-08
Heat-peelable adhesive sheet Grant 7,175,728 - Kiuchi , et al. February 13, 2	2007-02-13
Heat-peelable pressure-sensitive adhesive sheet Grant 7,163,597 - Murata , et al. January 16, 2	2007-01-16
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same Grant 7,147,743 - Kiuchi , et al. December 12, 2	2006-12-12
Heat-peelable adhesive sheet Grant 7,067,030 - Kiuchi , et al. June 27, 2	2006-06-27
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same Grant 7,029,550 - Kiuchi , et al. April 18, 2	2006-04-18
Heat-peelable pressure-sensitive adhesive sheet Grant 6,998,175 - Murata , et al. February 14, 2	2006-02-14
Heat-peelable adhesive sheet App 20050186419 - Kiuchi, Kazuyuki ; et al.	2005-08-25
Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit board App 20040177918 - Murata, Akihisa ; et al.	2004-09-16
Heat-peelable pressure-sensitive adhesive sheet App 20040038020 - Murata, Akihisa ; et al.	2004-02-26
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same App 20040003883 - Kiuchi, Kazuyuki ; et al.	2004-01-08
Energy-beam-curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same App 20040000370 - Kiuchi, Kazuyuki ; et al.	2004-01-01
Heat-peelable adhesive sheet App 20030203192 - Kiuchi, Kazuyuki ; et al.	2003-10-30
Heat-peelable pressure-sensitive adhesive sheet App 20030203193 - Murata, Akihisa ; et al.	2003-10-30
Heat-peelable pressure-sensitive adhesive sheet App 20020192463 - Kiuchi, Kazuyuki ; et al.	2002-12-19
Heat-peelable pressure-sensitive adhesive sheet App 20010055678 - Murata, Akihisa ; et al.	2001-12-27
Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same App 20010019765 - Kiuchi, Kazuyuki ; et al.	2001-09-06
Polyurethane resin composition Grant 5,550,198 - Oshima , et al. August 27, 1	1996-08-27
Reaction injection molding polyurea resin composition Grant 5,192,814 - Oshima , et al. March 9, 1	1993-03-09

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