Osenbach; John William
Patent Applications and Registrations
Patent applications and USPTO patent grants for Osenbach; John William.The latest application filed is for "manufacture of devices including solder bumps".
- Osenbach; John William - Kutztown PA
| Patent | Date |
|---|---|
| Integrated circuit package including wire bonds Grant 7,888,257 - Antol , et al. February 15, 2 | 2011-02-15 |
| Manufacture of devices including solder bumps Grant 7,727,781 - Antol , et al. June 1, 2 | 2010-06-01 |
| Method of making electronic entities Grant 7,724,359 - Amin , et al. May 25, 2 | 2010-05-25 |
| Electronic packages Grant 7,671,436 - Amin , et al. March 2, 2 | 2010-03-02 |
| Manufacture of devices including solder bumps App 20100022034 - Antol; Joze Eura ; et al. | 2010-01-28 |
| Method of making electronic entities App 20090298286 - Amin; Ahmed Nur ; et al. | 2009-12-03 |
| Electronic packages App 20090273078 - Amin; Ahmed Nur ; et al. | 2009-11-05 |
| Semiconductor device package with base features to reduce leakage Grant 7,541,669 - Carberry , et al. June 2, 2 | 2009-06-02 |
| Integrated circuit package including wire bonds App 20090098687 - Antol; Joze Eura ; et al. | 2009-04-16 |
| Methods and apparatus to reduce growth formations on plated conductive leads Grant 7,368,326 - Osenbach , et al. May 6, 2 | 2008-05-06 |
| Semiconductor device package with base features to reduce leakage App 20070241433 - Carberry; Patrick Joseph ; et al. | 2007-10-18 |
| Active optical alignment using MEMS mirrors Grant 7,277,173 - Bock , et al. October 2, 2 | 2007-10-02 |
| Device package Grant 7,242,090 - Brennan , et al. July 10, 2 | 2007-07-10 |
| Device packages Grant 7,235,422 - Brennan , et al. June 26, 2 | 2007-06-26 |
| Semiconductor device package with reduced leakage Grant 7,224,047 - Carberry , et al. May 29, 2 | 2007-05-29 |
| Techniques for reducing bowing in power transistor devices Grant 7,164,200 - Brennan , et al. January 16, 2 | 2007-01-16 |
| Whisker-free electronic structures App 20060266446 - Osenbach; John William ; et al. | 2006-11-30 |
| Device package App 20060170095 - Brennan; John M. ; et al. | 2006-08-03 |
| Device packages App 20060172465 - Brennan; John M. ; et al. | 2006-08-03 |
| Semiconductor device package with reduced leakage App 20060131707 - Carberry; Patrick Joseph ; et al. | 2006-06-22 |
| Kinetically controlled solder Grant 7,009,299 - Angst , et al. March 7, 2 | 2006-03-07 |
| Reinforced bond pad Grant 6,960,836 - Bachman , et al. November 1, 2 | 2005-11-01 |
| Techniques for reducing bowing in power transistor devices App 20050189616 - Brennan, John McKenna ; et al. | 2005-09-01 |
| Methods and apparatus to reduce growth formations on plated conductive leads App 20050153532 - Osenbach, John William ; et al. | 2005-07-14 |
| Methods and system for reinforcing a bond pad App 20050067709 - Bachman, Mark Adam ; et al. | 2005-03-31 |
| Silicon-based high speed optical wiring board Grant 6,862,378 - Karnacewicz , et al. March 1, 2 | 2005-03-01 |
| Optical component package Grant 6,770,224 - Bair , et al. August 3, 2 | 2004-08-03 |
| Optical Component Package App 20040124562 - Bair, Harvey Edward ; et al. | 2004-07-01 |
| Silicon-based high speed optical wiring board App 20040081385 - Karnacewicz, Mark ; et al. | 2004-04-29 |
| Plastic packaged optoelectronic device Grant 6,517,258 - Keska , et al. February 11, 2 | 2003-02-11 |
| Non-hermetic APD App 20020104989 - Chakrabarti, Utpal Kumar ; et al. | 2002-08-08 |
| Kinetically controlled solder bonding App 20020045330 - Angst, David L. ; et al. | 2002-04-18 |
| Optical waveguide device with enhanced stability Grant 6,282,356 - Johnston, Jr. , et al. August 28, 2 | 2001-08-28 |
| Optical devices having improved temperature stability Grant 6,195,191 - Osenbach , et al. February 27, 2 | 2001-02-27 |
| Method for improved metal oxide bonding of optical elements Grant 6,117,794 - Dormer , et al. September 12, 2 | 2000-09-12 |
| Method and compositions for achieving a kinetically controlled solder bond Grant 5,990,560 - Coult , et al. November 23, 1 | 1999-11-23 |
| Process for passivating semiconductor laser structures with severe steps in surface topography Grant 5,851,849 - Comizzoli , et al. December 22, 1 | 1998-12-22 |
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