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Patent applications and USPTO patent grants for Osborne, Jr.; Gordon C..The latest application filed is for "releasable buried layer for 3-d fabrication and methods of manufacturing".
Patent | Date |
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Releasable buried layer for 3-D fabrication and methods of manufacturing Grant 9,040,390 - Daubenspeck , et al. May 26, 2 | 2015-05-26 |
Releasable Buried Layer For 3-d Fabrication And Methods Of Manufacturing App 20130320521 - DAUBENSPECK; Timothy H. ;   et al. | 2013-12-05 |
Planarized plastic package modules for integrated circuits Grant 6,603,195 - Caletka , et al. August 5, 2 | 2003-08-05 |
Method and apparatus for testing integrated circuit chips Grant 5,528,159 - Charlton , et al. June 18, 1 | 1996-06-18 |
Method of bonding gold or gold alloy wire to lead tin solder Grant 4,907,734 - Conru , et al. March 13, 1 | 1990-03-13 |
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