Osanai; Hideyo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Osanai; Hideyo.The latest application filed is for "heat radiation member and method for producing same".

Company Profile

4.35.38

Osanai; Hideyo - Tokyo JP
Osanai; Hideyo - Nagano JP
Osanai; Hideyo - Shiojiri N/A JP
Osanai; Hideyo - Shiojiri-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat Radiation Member And Method For Producing Same App 20220080704 - Osanai; Hideyo ; et al.	2022-03-17
Metal/ceramic Bonding Substrate And Method For Producing Same App 20220032580 - Osanai; Hideyo	2022-02-03
Aluminum/ceramic Bonding Substrate And Method For Producing Same App 20220033317 - Kobayashi; Koji ; et al.	2022-02-03
Heat radiating plate and method for producing same Grant 11,162,745 - Ideguchi , et al. November 2, 2	2021-11-02
Heat radiating plate with supporting members and protrusion members Grant 10,619,948 - Ideguchi , et al.	2020-04-14
Electronic Part Mounting Substrate And Method For Producing Same App 20200083062 - Sunachi; Naoya ; et al.	2020-03-12
Heat Radiating Plate And Method For Producing Same App 20200064087 - Ideguchi; Satoru ; et al.	2020-02-27
Electronic part mounting substrate and method for producing same Grant 10,510,557 - Sunachi , et al. Dec	2019-12-17
Metal/ceramic bonding substrate and method for producing same Grant 9,944,565 - Osanai , et al. April 17, 2	2018-04-17
Method of attaching an electronic part to a copper plate having a surface roughness Grant 9,831,157 - Sunachi , et al. November 28, 2	2017-11-28
Metal/ceramic bonding substrate and method for producing same Grant 9,713,253 - Osanai , et al. July 18, 2	2017-07-18
Manufacturing method of radiator-integrated substrate and radiator-integrated substrate Grant 9,474,146 - Hori , et al. October 18, 2	2016-10-18
Electronic Part Mounting Substrate And Method For Producing Same App 20160211195 - Sunachi; Naoya ; et al.	2016-07-21
Liquid-cooled integrated substrate and manufacturing method of liquid-cooled integrated substrate Grant 9,320,129 - Hori , et al. April 19, 2	2016-04-19
Metal/ceramic Bonding Substrate And Method For Producing Same App 20150284296 - Osanai; Hideyo ; et al.	2015-10-08
Manufacturing Method Of Radiator-integrated Substrate And Radiator-integrated Substrate App 20150041187 - Hori; Hisashi ; et al.	2015-02-12
Fin-integrated substrate and manufacturing method of fin-integrated substrate Grant 8,927,873 - Hori , et al. January 6, 2	2015-01-06
Aluminum bonding member and method for producing same Grant 8,745,841 - Osanai June 10, 2	2014-06-10
Electronic Part Mounting Substrate And Method For Producing Same App 20140147695 - Sunachi; Naoya ; et al.	2014-05-29
Heat Radiating Plate And Method For Producing Same App 20140083671 - Ideguchi; Satoru ; et al.	2014-03-27
Metal/ceramic Bonding Substrate And Method For Producing Same App 20140057131 - Osanai; Hideyo ; et al.	2014-02-27
Liquid-cooled Integrated Substrate And Manufacturing Method Of Liquid-cooled Integrated Substrate App 20120305292 - Hori; Hisashi ; et al.	2012-12-06
Fin-integrated Substrate And Manufacturing Method Of Fin-integrated Substrate App 20120279761 - Hori; Hisashi ; et al.	2012-11-08
Aluminum Bonding Member And Method For Producing Same App 20120152482 - Osanai; Hideyo	2012-06-21
Electronic part mounting substrate and method for producing same Grant 8,039,757 - Osanai October 18, 2	2011-10-18
Apparatus, mold, and method for manufacturing metal-ceramic composite member Grant 8,011,416 - Osanai , et al. September 6, 2	2011-09-06
Method of manufacturing a metal-ceramic circuit board Grant 7,487,585 - Osanai , et al. February 10, 2	2009-02-10
Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof App 20080230515 - Iyoda; Ken ; et al.	2008-09-25
Aluminum/ceramic bonding substrate and method for producing same Grant 7,393,596 - Osanai , et al. July 1, 2	2008-07-01
Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof Grant 7,387,741 - Iyoda , et al. June 17, 2	2008-06-17
Circuit board and a power module employing the same Grant 7,368,665 - Hara , et al. May 6, 2	2008-05-06
Metal-ceramic circuit board Grant 7,348,493 - Osanai , et al. March 25, 2	2008-03-25
Method for producing metal/ceramic bonding circuit board Grant 7,340,828 - Osanai , et al. March 11, 2	2008-03-11
Aluminum/ceramic bonding substrate Grant 7,304,378 - Osanai December 4, 2	2007-12-04
Insulating substrate boards for semiconductor and power modules Grant 7,276,292 - Furo , et al. October 2, 2	2007-10-02
Aluminum/ceramic bonding substrate and method for producing same Grant 7,255,931 - Osanai , et al. August 14, 2	2007-08-14
Metal/ceramic bonding substrate and method for producing same Grant 7,256,353 - Osanai , et al. August 14, 2	2007-08-14
Electronic part mounting substrate and method for producing same App 20070089291 - Osanai; Hideyo	2007-04-26
Metal/ceramic bonding substrate and method for producing same Grant 7,189,449 - Osanai , et al. March 13, 2	2007-03-13
Aluminum/ceramic bonding substrate and method for producing same App 20070042215 - Osanai; Hideyo ; et al.	2007-02-22
Apparatus, mold, and method for manufacturing metal-ceramic composite member App 20070017652 - Osanai; Hideyo ; et al.	2007-01-25
Electronic part mounting substrate and method for producing same Grant 7,159,310 - Osanai January 9, 2	2007-01-09
Apparatus, mold, and method for manufacturing metal-ceramic composite member Grant 7,131,483 - Osanai , et al. November 7, 2	2006-11-07
Method of manufacturing a metal-ceramic circuit board App 20060242826 - Osanai; Hideyo ; et al.	2006-11-02
Metal/ceramic bonding substrate and method for producing same Grant 7,122,243 - Osanai , et al. October 17, 2	2006-10-17
Aluminum/ceramic bonding substrate and method for producing same Grant 7,073,703 - Takahashi , et al. July 11, 2	2006-07-11
Circuit board and a power module employing the same App 20060062979 - Hara; Masahiro ; et al.	2006-03-23
Circuit board, process for producing the same and a power module employing the same Grant 7,008,549 - Hara , et al. March 7, 2	2006-03-07
Aluminum/ceramic bonding substrate App 20060043574 - Osanai; Hideyo	2006-03-02
Mold and method for manufacturing metal-ceramic composite member Grant 6,997,233 - Osanai , et al. February 14, 2	2006-02-14
Aluminum bonding member and method for producing same App 20050217823 - Osanai, Hideyo	2005-10-06
Method of manufacturing a metal-ceramic circuit board Grant 6,938,333 - Osanai , et al. September 6, 2	2005-09-06
Method of manufacturing a metal-ceramic circuit board App 20050138799 - Osanai, Hideyo ; et al.	2005-06-30
Combined member of aluminum-ceramics Grant 6,912,130 - Osanai , et al. June 28, 2	2005-06-28
Metal/ceramic bonding substrate and method for producing same App 20050084704 - Osanai, Hideyo ; et al.	2005-04-21
Aluminum/ceramic bonding substrate and method for producing same App 20050072547 - Osanai, Hideyo ; et al.	2005-04-07
Method for producing metal/ceramic bonding circuit board App 20050060887 - Osanai, Hideyo ; et al.	2005-03-24
Electronic part mounting substrate and method for producing same App 20050047101 - Osanai, Hideyo	2005-03-03
Mold and method for manufacturing metal-ceramic composite member App 20050016707 - Osanai, Hideyo ; et al.	2005-01-27
Circuit board, process for producing the same and a power module employing the same App 20040191490 - Hara, Masahiro ; et al.	2004-09-30
Metal/ceramic bonding substrate and method for producing same App 20040144561 - Osanai, Hideyo ; et al.	2004-07-29
Apparatus, mold, and method for manufacturing metal-ceramic composite member App 20040123968 - Osanai, Hideyo ; et al.	2004-07-01
Aluminum/ceramic bonding substrate and method for producing same App 20040074951 - Takahashi, Takayuki ; et al.	2004-04-22
Combined member of aluminum-ceramics App 20040062009 - Osanai, Hideyo ; et al.	2004-04-01
Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof App 20030213773 - Iyoda, Ken ; et al.	2003-11-20
Method of manufacturing a metal-ceramic circuit board App 20030037434 - Osanai, Hideyo ; et al.	2003-02-27
Insulating substrate boards for semiconductor and power modules App 20020164488 - Furo, Masahiro ; et al.	2002-11-07
Metal-ceramic circuit board and manufacturing method thereof App 20020050510 - Osanai, Hideyo ; et al.	2002-05-02

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