Osada; Yuichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Osada; Yuichi.The latest application filed is for "polyamide-imide resin composition".
- Osada; Yuichi - Hitachi JP
| Patent | Date |
|---|---|
| Polyamide-imide resin composition Grant 4,530,975 - Mukoyama , et al. July 23, 1 | 1985-07-23 |
| Heat resistant resin and process for producing the same Grant 4,448,844 - Osada , et al. May 15, 1 | 1984-05-15 |
| Electrical insulating resin composition comprising a polyester resin or ester-imide resin Grant 4,127,553 - Osada , et al. November 28, 1 | 1978-11-28 |
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