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Patent applications and USPTO patent grants for Ortleb; Thomas.The latest application filed is for "reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices".
Patent | Date |
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Automatic deposition profile targeting Grant 8,323,471 - Ortleb , et al. December 4, 2 | 2012-12-04 |
Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback Grant 7,899,570 - Ortleb , et al. March 1, 2 | 2011-03-01 |
Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices Grant 7,781,329 - Preusse , et al. August 24, 2 | 2010-08-24 |
Reducing Leakage In Dielectric Materials Including Metal Regions Including A Metal Cap Layer In Semiconductor Devices App 20090325375 - Preusse; Axel ;   et al. | 2009-12-31 |
Advanced Automatic Deposition Profile Targeting And Control By Applying Advanced Polish Endpoint System Feedback App 20090036029 - Ortleb; Thomas ;   et al. | 2009-02-05 |
Automatic Deposition Profile Targeting App 20090000950 - Ortleb; Thomas ;   et al. | 2009-01-01 |
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