Ort; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ort; Thomas.The latest application filed is for "face-up fan-out electronic package with passive components using a support".

Company Profile

20.10.19

Ort; Thomas - Veitsbronn DE
ORT; THOMAS - YORK PA
Ort; Thomas - Regensburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fan out package with integrated peripheral devices and methods Grant 11,404,339 - Keser , et al. August 2, 2	2022-08-02
Face-up Fan-out Electronic Package With Passive Components Using A Support App 20220051990 - Keser; Lizabeth ; et al.	2022-02-17
Face-up fan-out electronic package with passive components using a support Grant 11,211,337 - Keser , et al. December 28, 2	2021-12-28
Component magnetic shielding for microelectronic devices Grant 10,867,934 - Maruthamuthu , et al. December 15, 2	2020-12-15
Fan Out Package With Integrated Peripheral Devices And Methods App 20200303274 - Keser; Lizabeth ; et al.	2020-09-24
Fan Out Package And Methods App 20200251396 - Kind Code	2020-08-06
Molded substrate package in fan-out wafer level package Grant 10,720,393 - Keser , et al.	2020-07-21
Semiconductor Packages, and Methods for Forming Semiconductor Packages App 20200227388 - Waidhas; Bernd ; et al.	2020-07-16
Fan out package with integrated peripheral devices and methods Grant 10,699,980 - Keser , et al.	2020-06-30
Package including an integrated routing layer and a molded routing layer Grant 10,665,522 - Keser , et al.	2020-05-26
Runner For A Hydroelectric Axial Turbine Or Pump App 20200158073 - COULSON; STUART ; et al.	2020-05-21
Face-up Fan-out Electronic Package With Passive Components Using A Support App 20200105678 - Keser; Lizabeth ; et al.	2020-04-02
Face-up fan-out electronic package with passive components using a support Grant 10,546,817 - Keser , et al. Ja	2020-01-28
Molded Substrate Package In Fan-out Wafer Level Package App 20190393154 - Keser; Lizabeth ; et al.	2019-12-26
Fan Out Package With Integrated Peripheral Devices And Methods App 20190304863 - Keser; Lizabeth ; et al.	2019-10-03
Component Magnetic Shielding For Microelectronic Devices App 20190304922 - Maruthamuthu; Saravana ; et al.	2019-10-03
Molded substrate package in fan-out wafer level package Grant 10,403,580 - Keser , et al. Sep	2019-09-03
Thermal Conduction Devices And Methods For Embedded Electronic Devices App 20190214327 - Koller; Sonja ; et al.	2019-07-11
Face-up Fan-out Electronic Package With Passive Components Using A Support App 20190206799 - Keser; Lizabeth ; et al.	2019-07-04
Molded Substrate Package In Fan-out Wafer Level Package App 20190206800 - Keser; Lizabeth ; et al.	2019-07-04
Fan Out Package And Methods App 20190198478 - Keser; Lizabeth ; et al.	2019-06-27
Method and system for routing electrical connections of semiconductor chips Grant 8,598,709 - Meyer , et al. December 3, 2	2013-12-03
Rotated Semiconductor Device Fan-out Wafer Level Packages And Methods Of Manufacturing Rotated Semiconductor Device Fan-out Wafer Level Packages App 20130256883 - Meyer; Thorsten ; et al.	2013-10-03
Method And System For Routing Electrical Connections Of Semiconductor Chips App 20120049375 - MEYER; Thorsten ; et al.	2012-03-01
Electronic component and electronic configuration App 20070018308 - Schott; Albert ; et al.	2007-01-25

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