loadpatents
name:-0.026482820510864
name:-0.02342700958252
name:-0.015474081039429
Orikasa; Makoto Patent Filings

Orikasa; Makoto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Orikasa; Makoto.The latest application filed is for "coil component and wireless communication circuit using the same".

Company Profile
15.23.30
  • Orikasa; Makoto - Tokyo JP
  • Orikasa; Makoto - Gunma JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Noise suppression sheet
Grant 11,419,250 - Yamada , et al. August 16, 2
2022-08-16
Method of producing electroconductive substrate, electronic device and display device
Grant 11,410,855 - Daitoku , et al. August 9, 2
2022-08-09
Coil Component And Wireless Communication Circuit Using The Same
App 20220059938 - MATSUSHIMA; Masaki ;   et al.
2022-02-24
Noise Suppression Sheet
App 20210360840 - YAMADA; Takashi ;   et al.
2021-11-18
Noise Suppression Sheet
App 20210360839 - YAMADA; Takashi ;   et al.
2021-11-18
Noise Suppression Sheet
App 20210354426 - YAMADA; Takashi ;   et al.
2021-11-18
Electroconductive Substrate, Electronic Device And Display Device
App 20210265256 - DAITOKU; Takashi ;   et al.
2021-08-26
Junction structure
Grant 11,088,308 - Satou , et al. August 10, 2
2021-08-10
Electroconductive substrate, electronic device and display device
Grant 11,031,330 - Daitoku , et al. June 8, 2
2021-06-08
Sheet material, metal mesh, wiring substrate, display device and manufacturing methods therefor
Grant 10,968,519 - Orikasa , et al. April 6, 2
2021-04-06
Sheet Material, Metal Mesh, Wiring Substrate, Display Device And Manufacturing Methods Therefor
App 20210087692 - ORIKASA; Makoto ;   et al.
2021-03-25
Electroconductive substrate, electronic device and display device
Grant 10,867,898 - Daitoku , et al. December 15, 2
2020-12-15
Method Of Producing Electroconductive Substrate, Electronic Device And Display Device
App 20200381266 - DAITOKU; Takashi ;   et al.
2020-12-03
Junction Structure
App 20200321499 - SATOU; Takasi ;   et al.
2020-10-08
Method of producing electroconductive substrate, electronic device and display device
Grant 10,784,122 - Daitoku , et al. Sept
2020-09-22
Electroconductive Substrate, Electronic Device And Display Device
App 20200211951 - DAITOKU; Takashi ;   et al.
2020-07-02
Wiring component
Grant 10,374,301 - Horikawa , et al.
2019-08-06
Method for manufacturing planar coil
Grant 10,354,796 - Horikawa , et al. July 16, 2
2019-07-16
Method for producing semiconductor chip
Grant 10,354,973 - Orikasa , et al. July 16, 2
2019-07-16
Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof
Grant 10,304,779 - Orikasa , et al.
2019-05-28
Method Of Producing Electroconductive Substrate, Electronic Device And Display Device
App 20190043736 - DAITOKU; Takashi ;   et al.
2019-02-07
Sheet Material, Metal Mesh And Method For Manufacturing Thereof
App 20190032221 - ORIKASA; Makoto ;   et al.
2019-01-31
Electroconductive Substrate, Electronic Device And Display Device
App 20190035719 - DAITOKU; Takashi ;   et al.
2019-01-31
Sheet Material, Metal Mesh, Wiring Substrate, Display Device And Manufacturing Methods Therefor
App 20190032219 - ORIKASA; Makoto ;   et al.
2019-01-31
Method For Producing Semiconductor Chip
App 20190013293 - ORIKASA; Makoto ;   et al.
2019-01-10
Method for producing semiconductor package
Grant 10,163,847 - Orikasa , et al. Dec
2018-12-25
Method For Producing Semiconductor Package
App 20180254255 - ORIKASA; Makoto ;   et al.
2018-09-06
Method For Manufacturing Planar Coil
App 20180174748 - Horikawa; Yuhei ;   et al.
2018-06-21
Wiring Component
App 20180175494 - Horikawa; Yuhei ;   et al.
2018-06-21
Electronic Component Module And Manufacturing Method Thereof
App 20180114759 - ORIKASA; Makoto ;   et al.
2018-04-26
Method for producing semiconductor package
Grant 9,818,736 - Orikasa , et al. November 14, 2
2017-11-14
Magnetic head device
Grant 9,620,156 - Igarashi , et al. April 11, 2
2017-04-11
Magnetic head device having suspension and spacer
Grant 9,514,772 - Kawashima , et al. December 6, 2
2016-12-06
Magnetic Head Device
App 20160275976 - IGARASHI; Katsuhiko ;   et al.
2016-09-22
Magnetic Head Device
App 20160275975 - KAWASHIMA; Takashi ;   et al.
2016-09-22
Electronic component module
Grant 9,293,421 - Yanagida , et al. March 22, 2
2016-03-22
Terminal structure, and semiconductor element and module substrate comprising the same
Grant 9,257,402 - Yoshida , et al. February 9, 2
2016-02-09
Coating and electronic component
Grant 9,177,687 - Yoshida , et al. November 3, 2
2015-11-03
Electronic Component Module
App 20150255401 - YANAGIDA; Miyuki ;   et al.
2015-09-10
Terminal structure and semiconductor device
Grant 9,070,606 - Yoshida , et al. June 30, 2
2015-06-30
Terminal structure, and semiconductor element and module substrate comprising the same
Grant 8,970,037 - Yoshida , et al. March 3, 2
2015-03-03
Coating and electronic component
Grant 8,933,336 - Yoshida , et al. January 13, 2
2015-01-13
Terminal structure, printed circuit board, module board, electronic device, and method for manufacturing terminal structure
Grant 8,787,028 - Horikawa , et al. July 22, 2
2014-07-22
Terminal Structure And Semiconductor Device
App 20140054768 - YOSHIDA; Kenichi ;   et al.
2014-02-27
Terminal Structure And Semiconductor Device
App 20140054767 - YOSHIDA; Kenichi ;   et al.
2014-02-27
Terminal Structure, And Semiconductor Element And Module Substrate Comprising The Same
App 20140054769 - YOSHIDA; Kenichi ;   et al.
2014-02-27
Terminal Structure, And Semiconductor Element And Module Substrate Comprising The Same
App 20140054770 - YOSHIDA; Kenichi ;   et al.
2014-02-27
Structure Body And Electronic Component And Printed Wiring Board Including The Same
App 20130192873 - ORIKASA; Makoto ;   et al.
2013-08-01
Terminal Structure, Printed Circuit Board, Module Board, Electronic Device, And Method For Manufacturing Terminal Structure
App 20130135834 - Horikawa; Yuhei ;   et al.
2013-05-30
Coating And Electronic Component
App 20130126208 - YOSHIDA; Kenichi ;   et al.
2013-05-23
Coating And Electronic Component
App 20130130059 - YOSHIDA; Kenichi ;   et al.
2013-05-23
Tin electrolytic plating solution for electronic parts, method for tin electrolytic plating of electronic parts, and tin electroplated electronic parts
Grant 8,083,922 - Orikasa , et al. December 27, 2
2011-12-27
Tin Electrolytic Plating Solution For Electronic Parts, Method For Tin Electrolytic Plating Of Electronic Parts, And Tin Electroplated Electronic Parts
App 20090061241 - Orikasa; Makoto ;   et al.
2009-03-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed