Optiz, Inc.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Optiz, Inc..The latest application filed is for "monolithic multi-focus light source device".

Company Profile

2.69.40

Optiz, Inc. - Palo Alto CA US
Optiz, Inc. -
Optiz, Inc - Palo Alto CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Monolithic multi-focus light source device Grant 11,408,589 - Oganesian August 9, 2	2022-08-09
Monolithic Multi-Focus Light Source Device App 20210172581 - Oganesian; Vage	2021-06-10
Method of making a sensor package with cooling feature Grant 10,199,519 - Oganesian , et al. Fe	2019-02-05
Back side illumination image sensor with non-planar optical interface Grant 10,139,619 - Oganesian , et al. Nov	2018-11-27
Method Of Making A Sensor Package With Cooling Feature App 20180226517 - Oganesian; Vage ; et al.	2018-08-09
Under screen sensor assembly Grant 9,996,725 - Oganesian June 12, 2	2018-06-12
Imaging device with photo detectors and color filters arranged by color transmission characteristics and absorption coefficients Grant 9,985,063 - Oganesian , et al. May 29, 2	2018-05-29
Method of making a sensor package with cooling feature Grant 9,972,730 - Oganesian , et al. May 15, 2	2018-05-15
Under Screen Sensor Assembly App 20180121705 - Oganesian; Vage	2018-05-03
Method of forming a wire bond sensor package Grant 9,893,213 - Oganesian , et al. February 13, 2	2018-02-13
Sensor package with cooling feature Grant 9,893,218 - Oganesian , et al. February 13, 2	2018-02-13
Method of forming a stress released image sensor package structure Grant 9,853,079 - Oganesian , et al. December 26, 2	2017-12-26
Method Of Forming A Wire Bond Sensor Package App 20170222065 - Oganesian; Vage ; et al.	2017-08-03
Method of making low profile sensor package with cooling feature Grant 9,666,625 - Oganesian , et al. May 30, 2	2017-05-30
Three dimensional system-on-chip image sensor package Grant 9,667,900 - Oganesian , et al. May 30, 2	2017-05-30
Wire bond sensor package Grant 9,666,730 - Oganesian , et al. May 30, 2	2017-05-30
Method Of Forming A Stress Released Image Sensor Package Structure App 20170084656 - Oganesian; Vage ; et al.	2017-03-23
Sensor package with exposed sensor array and method of making same Grant 9,570,634 - Oganesian , et al. February 14, 2	2017-02-14
Method Of Making A Sensor Package With Cooling Feature App 20170033136 - Oganesian; Vage ; et al.	2017-02-02
Sensor Package With Cooling Feature App 20170033241 - Oganesian; Vage ; et al.	2017-02-02
Stress released image sensor package structure and method Grant 9,543,347 - Oganesian , et al. January 10, 2	2017-01-10
Method Of Making Low Profile Sensor Package With Cooling Feature App 20160380018 - Oganesian; Vage ; et al.	2016-12-29
Chip level heat dissipation using silicon Grant 9,524,917 - Oganesian December 20, 2	2016-12-20
Sensor package with cooling feature and method of making same Grant 9,496,297 - Oganesian , et al. November 15, 2	2016-11-15
Integrated camera module and method of making same Grant 9,496,247 - Oganesian , et al. November 15, 2	2016-11-15
Low profile sensor package with cooling feature and method of making same Grant 9,461,190 - Oganesian , et al. October 4, 2	2016-10-04
Stress Released Image Sensor Package Structure And Method App 20160247849 - Oganesian; Vage ; et al.	2016-08-25
Back Side Illumination Image Sensor With Non-Planar Optical Interface App 20160238836 - Oganesian; Vage ; et al.	2016-08-18
Method of forming a low profile image sensor package with an image sensor substrate, a support substrate and a printed circuit board Grant 9,373,660 - Oganesian June 21, 2	2016-06-21
Stepped package for image sensor Grant 9,373,653 - Oganesian June 21, 2	2016-06-21
Wire Bond Sensor Package And Method App 20160049526 - Oganesian; Vage ; et al.	2016-02-18
Sensor Package With Exposed Sensor Array And Method Of Making Same App 20160043240 - Oganesian; Vage ; et al.	2016-02-11
Method Of Forming A Low Profile Image Sensor Package App 20160035785 - OGANESIAN; VAGE	2016-02-04
Method of making stamped multi-layer polymer lens Grant 9,233,511 - Oganesian , et al. January 12, 2	2016-01-12
Method of forming 3D integrated microelectronic assembly with stress reducing interconnects Grant 9,230,947 - Oganesian January 5, 2	2016-01-05
Low profile sensor module and method of making same Grant 9,219,091 - Oganesian , et al. December 22, 2	2015-12-22
Method of making interposer package for CMOS image sensor Grant 9,214,592 - Oganesian December 15, 2	2015-12-15
Method of forming a low profile image sensor package Grant 9,196,650 - Oganesian November 24, 2	2015-11-24
Low profile image sensor Grant 9,190,443 - Oganesian , et al. November 17, 2	2015-11-17
Chip Level Heat Dissipation Using Silicon App 20150311137 - Oganesian; Vage	2015-10-29
Color Filter And Photodiode Patterning Configuration App 20150303231 - Oganesian; Vage ; et al.	2015-10-22
Sensor package with exposed sensor array and method of making same Grant 9,142,695 - Oganesian , et al. September 22, 2	2015-09-22
Stepped Package For Image Sensor App 20150200219 - Oganesian; Vage	2015-07-16
Semiconductor Device On Cover Substrate And Method Of Making Same App 20150189204 - Oganesian; Vage ; et al.	2015-07-02
Sensor Package With Cooling Feature And Method Of Making Same App 20150162366 - Oganesian; Vage ; et al.	2015-06-11
Three Dimensional System-On-Chip Image Sensor Package App 20150163425 - Oganesian; Vage ; et al.	2015-06-11
Method of making 3D integration microelectronic assembly for integrated circuit devices Grant 9,054,013 - Oganesian June 9, 2	2015-06-09
Stepped package for image sensor and method of making same Grant 9,018,725 - Oganesian April 28, 2	2015-04-28
Low Profile Sensor Package With Cooling Feature And Method Of Making Same App 20150084148 - Oganesian; Vage ; et al.	2015-03-26
Integrated Camera Module And Method Of Making Same App 20150054001 - Oganesian; Vage ; et al.	2015-02-26
Integrated image sensor package with liquid crystal lens Grant 8,921,759 - Oganesian December 30, 2	2014-12-30
Sensor Package With Exposed Sensor Array And Method Of Making Same App 20140353789 - Oganesian; Vage ; et al.	2014-12-04
Method of making a low stress cavity package for back side illuminated image sensor Grant 8,895,344 - Oganesian November 25, 2	2014-11-25
Method Of Making Interposer Package For Cmos Image Sensor App 20140322856 - Oganesian; Vage	2014-10-30
Low Profile Sensor Module And Method Of Making Same App 20140264692 - Oganesian; Vage ; et al.	2014-09-18
Low Profile Image Sensor App 20140264691 - Oganesian; Vage ; et al.	2014-09-18
Cover-Free Sensor Module And Method Of Making Same App 20140264693 - Oganesian; Vage ; et al.	2014-09-18
Method Of Forming A Low Profile Image Sensor Package App 20140248736 - Oganesian; Vage	2014-09-04
Interposer package for CMOS image sensor and method of making same Grant 8,796,800 - Oganesian August 5, 2	2014-08-05
Low profile image sensor package Grant 8,759,930 - Oganesian June 24, 2	2014-06-24
Method of making 3D integration microelectronic assembly for integrated circuit devices Grant 8,753,925 - Oganesian June 17, 2	2014-06-17
Back side illuminated image sensor architecture, and method of making same Grant 8,692,344 - Oganesian April 8, 2	2014-04-08
Method Of Making A Low Stress Cavity Package For Back Side Illuminated Image Sensor App 20140065755 - Oganesian; Vage	2014-03-06
Method Of Making 3D Integration Microelectronic Assembly For Integrated Circuit Devices App 20140004664 - Oganesian; Vage	2014-01-02
Method Of Forming 3D Integrated Microelectronic Assembly With Stress Reducing Interconnects App 20140004647 - Oganesian; Vage	2014-01-02
Method Of Making 3D Integration Microelectronic Assembly For Integrated Circuit Devices App 20140004646 - Oganesian; Vage	2014-01-02
Multi-layer polymer lens and method of making same Grant 8,570,669 - Oganesian October 29, 2	2013-10-29
3D integrated microelectronic assembly with stress reducing interconnects Grant 8,552,518 - Oganesian October 8, 2	2013-10-08
3D integration microelectronic assembly for integrated circuit devices Grant 8,546,951 - Oganesian October 1, 2	2013-10-01
3D integration microelectronic assembly for integrated circuit devices Grant 8,546,900 - Oganesian October 1, 2	2013-10-01
Wire bond interposer package for CMOS image sensor and method of making same Grant 8,432,011 - Oganesian April 30, 2	2013-04-30