Oppermann; Klaus-Gunter

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oppermann; Klaus-Gunter.The latest application filed is for "apparatus for housing a micromechanical structure".

Company Profile

0.8.11

Oppermann; Klaus-Gunter - Holzkirchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus for housing a micromechanical structure Grant 7,692,317 - Franosch , et al. April 6, 2	2010-04-06
Apparatus For Housing A Micromechanical Structure App 20080017974 - FRANOSCH; MARTIN ; et al.	2008-01-24
Apparatus for housing a micromechanical structure and method for producing the same Grant 7,300,823 - Franosch , et al. November 27, 2	2007-11-27
Method for producing a protective cover for a device Grant 7,234,237 - Franosch , et al. June 26, 2	2007-06-26
Method for generating a protective cover for a device Grant 6,955,950 - Aigner , et al. October 18, 2	2005-10-18
Method for producing a protective cover for a device Grant 6,939,734 - Franosch , et al. September 6, 2	2005-09-06
Apparatus for housing a micromechanical structure and method for producing the same App 20050146022 - Franosch, Martin ; et al.	2005-07-07
Method for producing a protective cover for a device App 20050148205 - Franosch, Martin ; et al.	2005-07-07
Method for generating a protective cover for a device App 20050048757 - Aigner, Robert ; et al.	2005-03-03
Method for producing a protective cover for a device App 20050009316 - Franosch, Martin ; et al.	2005-01-13
Semiconductor component for high reverse voltages in conjunction with a low on resistance and method for fabricating a semiconductor component Grant 6,762,455 - Oppermann , et al. July 13, 2	2004-07-13
Method for producing a filled recess in a material layer, and an integrated circuit configuration produced by the method Grant 6,724,058 - Aigner , et al. April 20, 2	2004-04-20
Semiconductor component for high reverse voltages in conjunction with a low on resistance and method for fabricating a semiconductor component App 20020117715 - Oppermann, Klaus-Gunter ; et al.	2002-08-29
Micromechanical component protected from environmental influences App 20010054315 - Aigner, Robert ; et al.	2001-12-27
Deformation gauge App 20010048139 - Aigner, Robert ; et al.	2001-12-06
Micromechanical component and process for its fabrication App 20010021538 - Aigner, Robert ; et al.	2001-09-13
Configuration with a plurality of sensor groups and method of determining its intactness App 20010013773 - Aigner, Robert ; et al.	2001-08-16
Method for producing a filled recess in a material layer, and an integrated circuit configuration produced by the method App 20010005032 - Aigner, Robert ; et al.	2001-06-28
Photodiode having reduced series resistance, and method for fabrication thereof Grant 5,994,751 - Oppermann November 30, 1	1999-11-30

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