Ootsuki; Yuto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ootsuki; Yuto.The latest application filed is for "cmp polishing slurry and polishing method".

Company Profile

0.5.5

Ootsuki; Yuto - Hitachi JP
Ootsuki; Yuto - Hitachi-shi JP
Ootsuki; Yuto - Ibaraki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing slurry for chemical mechanical polishing and method for polishing substrate Grant 8,231,735 - Haga , et al. July 31, 2	2012-07-31
CMP polishing slurry and polishing method Grant 8,168,541 - Fukasawa , et al. May 1, 2	2012-05-01
Cmp Polishing Slurry And Polishing Method App 20110028073 - Fukasawa; Masato ; et al.	2011-02-03
CMP polishing slurry and polishing method Grant 7,837,800 - Fukasawa , et al. November 23, 2	2010-11-23
CMP polishing compound and polishing method Grant 7,838,482 - Fukasawa , et al. November 23, 2	2010-11-23
CMP polishing slurry and polishing method App 20080214093 - Fukasawa; Masato ; et al.	2008-09-04
Polishing slurry for chemical mechanical polishing and method for polishing substrate App 20080176982 - Haga; Kouji ; et al.	2008-07-24
Polishing slurry for chemical mechanical polishing and method for polishing substrate Grant 7,311,855 - Haga , et al. December 25, 2	2007-12-25
Cmp polishing compound and polishing method App 20060148667 - Fukasawa; Masato ; et al.	2006-07-06
Polishing slurry for chemical mechanical polishing and method for polishing substrate App 20060124591 - Haga; Kouji ; et al.	2006-06-15

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