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Patent applications and USPTO patent grants for Ootera; Hiroki.The latest application filed is for "semiconductor device".
Patent | Date |
---|---|
Semiconductor device Grant 6,787,874 - Ootera September 7, 2 | 2004-09-07 |
Method of fabricating a semiconductor device including time-selective etching process Grant 6,756,312 - Shintani , et al. June 29, 2 | 2004-06-29 |
Semiconductor Device App 20030107061 - Ootera, Hiroki | 2003-06-12 |
Plasma processing apparatus App 20020088542 - Nishikawa, Kazuyasu ;   et al. | 2002-07-11 |
Plasma processing apparatus Grant 6,417,111 - Nishikawa , et al. July 9, 2 | 2002-07-09 |
Method of fabricating semiconductor device and wafer treatment apparatus employed therefor as well as semiconductor device App 20020052120 - Shintani, Kenji ;   et al. | 2002-05-02 |
Plasma generating apparatus App 20020047544 - Nishikawa, Kazuyasu ;   et al. | 2002-04-25 |
Plasma generating apparatus Grant 6,335,595 - Nishikawa , et al. January 1, 2 | 2002-01-01 |
Plasma processing apparatus App 20010050144 - Nishikawa, Kazuyasu ;   et al. | 2001-12-13 |
Plasma processing apparatus Grant 6,244,211 - Nishikawa , et al. June 12, 2 | 2001-06-12 |
Two chamber plasma processing apparatus Grant 6,167,835 - Ootera , et al. January 2, 2 | 2001-01-02 |
Plasma processing apparatus using a partition panel Grant 6,076,483 - Shintani , et al. June 20, 2 | 2000-06-20 |
Plasma processing apparatus Grant 5,733,405 - Taki , et al. March 31, 1 | 1998-03-31 |
Plasma processor Grant 5,115,167 - Ootera , et al. May 19, 1 | 1992-05-19 |
Plasma processor Grant 4,947,085 - Nakanishi , et al. August 7, 1 | 1990-08-07 |
Apparatus for uniformly distributing plasma over a substrate Grant 4,894,510 - Nakanishi , et al. January 16, 1 | 1990-01-16 |
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