Ootani; Yuji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ootani; Yuji.The latest application filed is for "conductor composition, a mounting substrate and a mounting structure utilizing the composition".

Company Profile

0.5.4

Ootani; Yuji - Aichi-pref. JP
Ootani; Yuji - Nukata-gun JP
Ootani; Yuji - Okazaki JP
Ootani, Yuji - Okazaki-city JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductor composition, a mounting substrate and a mounting structure utilizing the composition Grant 7,807,073 - Totokawa , et al. October 5, 2	2010-10-05
Conductor composition, a mounting substrate and a mounting structure utilizing the composition Grant 7,276,185 - Totokawa , et al. October 2, 2	2007-10-02
Conductor composition, a mounting substrate and a mounting structure utilizing the composition App 20070224511 - Totokawa; Masashi ; et al.	2007-09-27
Conductor composition, a mounting substrate and a mounting structure utilizing the composition App 20050127536 - Totokawa, Masashi ; et al.	2005-06-16
Semiconductor device including bonded wire based to electronic part and method for manufacturing the same Grant 6,731,001 - Kinouchi , et al. May 4, 2	2004-05-04
Electronic part mounting method Grant 6,601,752 - Maeda , et al. August 5, 2	2003-08-05
Semiconductor device including bonding wire bonded to electronic part and method for manufacturing the same App 20020020910 - Kinouchi, Kan ; et al.	2002-02-21
Electronic part mounting method App 20010020635 - Maeda, Yukihiro ; et al.	2001-09-13
Conductive paste composition including conductive metallic powder Grant 6,174,462 - Oka , et al. January 16, 2	2001-01-16

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