Ootake; Hironao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ootake; Hironao.The latest application filed is for "pressure-bonding pressure-sensitive adhesive member".
- Ootake; Hironao - Ibaraki JP
- OOTAKE; Hironao - Ibaraki-shi Osaka
- Ootake; Hironao - Osaka JP
| Patent | Date |
|---|---|
| Separator Grant 11,236,254 - Kosaka , et al. February 1, 2 | 2022-02-01 |
| Pressure-bonding Pressure-sensitive Adhesive Member App 20200270483 - CHIBA; Mizuho ; et al. | 2020-08-27 |
| Separator App 20190241769 - KOSAKA; Naofumi ; et al. | 2019-08-08 |
| Water-dispersed Acrylic Adhesive Composition App 20190194507 - CHIBA; Mizuho ; et al. | 2019-06-27 |
| Pressure-sensitive Adhesive Composition And Pressure-sensitive Adhesive Sheet App 20140213716 - OKADA; Yoshihiro ; et al. | 2014-07-31 |
| Dicing/die bonding film Grant 8,617,928 - Kamiya , et al. December 31, 2 | 2013-12-31 |
| Pressure-sensitive Adhesive Composition And Pressure-sensitive Adhesive Sheet App 20130323498 - TAKAHASHI; Akiko ; et al. | 2013-12-05 |
| Aqueous Dispersion Pressure-sensitive Adhesive Composition And Pressure-sensitive Adhesive Sheet App 20120277368 - KOSO; Masatsugu ; et al. | 2012-11-01 |
| Double-sided Pressure-sensitive Adhesive Sheet App 20120231267 - OOTAKE; Hironao ; et al. | 2012-09-13 |
| Pressure-sensitive Adhesive Composition And Use Thereof App 20120157593 - OOTAKE; Hironao ; et al. | 2012-06-21 |
| Pressure-sensitive Adhesive Sheet App 20120114930 - YAMAMOTO; Kenichi ; et al. | 2012-05-10 |
| Dicing die-bonding film Grant 8,119,236 - Kamiya , et al. February 21, 2 | 2012-02-21 |
| Dicing/die Bonding Film App 20110104873 - Kamiya; Katsuhiko ; et al. | 2011-05-05 |
| Dicing die-bonding film and process for producing semiconductor device Grant 7,880,316 - Ootake , et al. February 1, 2 | 2011-02-01 |
| Laminated Film And Process For Producing Semiconductor Device App 20100279468 - OOTAKE; Hironao ; et al. | 2010-11-04 |
| Laminated Film And Process For Producing Semiconductor Device App 20100279109 - OOTAKE; Hironao ; et al. | 2010-11-04 |
| Laminated Film And Process For Producing Semiconductor Device App 20100279050 - Ootake; Hironao ; et al. | 2010-11-04 |
| Dicing Die-bonding Film And Process For Producing Semiconductor Device App 20100129987 - KAMIYA; Katsuhiko ; et al. | 2010-05-27 |
| Dicing Die-bonding Film And Process For Producing Semiconductor Device App 20100129985 - OOTAKE; Hironao ; et al. | 2010-05-27 |
| Dicing Die-bonding Film And Process For Producing Semiconductor Device App 20100129989 - Kamiya; Katsuhiko ; et al. | 2010-05-27 |
| Dicing Die-bonding Film And Process For Producing Semiconductor Device App 20100129988 - OOTAKE; Hironao ; et al. | 2010-05-27 |
| Dicing Die-bonding Film And Process For Producing Semiconductor Device App 20100129986 - KAMIYA; Katsuhiko ; et al. | 2010-05-27 |
| Dicing Die-bonding Film App 20100028687 - Kamiya; Katsuhiko ; et al. | 2010-02-04 |
| Dicing Die-bonding Film App 20100029061 - Kamiya; Katsuhiko ; et al. | 2010-02-04 |
| Dicing Die-bonding Film App 20100029060 - Kamiya; Katsuhiko ; et al. | 2010-02-04 |
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