loadpatents
name:-0.0015480518341064
name:-0.0042479038238525
name:-0.0020740032196045
Oota; Hideaki Patent Filings

Oota; Hideaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oota; Hideaki.The latest application filed is for "method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material and cut brittle material".

Company Profile
1.3.1
  • Oota; Hideaki - Matsusaka JP
  • OOTA; Hideaki - Matsusaka City JP
  • Oota; Hideaki - Nagasaki JP
  • Oota; Hideaki - Takeyama Midori-ku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed