Oosawa; Eiki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Oosawa; Eiki.The latest application filed is for "solder ball jet nozzle having improved reliability".

Company Profile

0.8.7

Oosawa; Eiki - Odawara JP
Oosawa; Eiki - Odawara-shi JP
Oosawa; Eiki - Kanagawa JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solder ball jet nozzle having improved reliability Grant 10,029,327 - Murata , et al. July 24, 2	2018-07-24
Solder Ball Jet Nozzle Having Improved Reliability App 20160121416 - Murata; Kenichi ; et al.	2016-05-05
Apparatus for interconnecting connection pads of a head-gimbal assembly and manufacturing method for the head-gimbal assembly Grant 8,881,967 - Matsumoto , et al. November 11, 2	2014-11-11
Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length Grant 8,503,132 - Oosawa August 6, 2	2013-08-06
Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge Grant 8,477,457 - Matsumoto , et al. July 2, 2	2013-07-02
Head-gimbal Assembly With A Suspension-lead Pad Having A Form That Is Configured To Inhibit Formation Of An Inter-pad Solder Bridge App 20130063839 - Matsumoto; Yuhsuke ; et al.	2013-03-14
Method and apparatus for manufacturing a head-gimbal assembly Grant 8,245,749 - Imai , et al. August 21, 2	2012-08-21
Connecting Electrical Parts App 20110132879 - Matsumoto; Yuhsuke ; et al.	2011-06-09
Method And Apparatus For Manufacturing A Head-gimbal Assembly App 20100154989 - IMAI; Hideto ; et al.	2010-06-24
Apparatus For Interconnecting Connection Pads Of A Head-gimbal Assembly And Manufacturing Method For The Head-gimbal Assembly App 20100089981 - Matsumoto; Yohsuke ; et al.	2010-04-15
Magnetic head slider and suspension for magnetic head App 20070047144 - Oosawa; Eiki	2007-03-01

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