Ookura; Yasushi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ookura; Yasushi.The latest application filed is for "semiconductor device and method for manufacturing the same".
- Ookura; Yasushi - Okazaki JP
- Ookura; Yasushi - Kariya JP
- OOKURA; Yasushi - Kariya-city JP
- Ookura; Yasushi - Okazaki-city JP
- OOKURA; Yasushi - Okazaki-shi JP
- Ookura; Yasushi - Toyokawa JP
- Ookura, Yasushi - Toyokawa-city JP
| Patent | Date |
|---|---|
| Semiconductor device Grant 10,002,807 - Ookura June 19, 2 | 2018-06-19 |
| Semiconductor device Grant 9,691,713 - Sugiura , et al. June 27, 2 | 2017-06-27 |
| Semiconductor device and method for manufacturing the same Grant 9,502,327 - Sugiura , et al. November 22, 2 | 2016-11-22 |
| Semiconductor Device And Method For Manufacturing The Same App 20160204047 - SUGIURA; Shun ; et al. | 2016-07-14 |
| Semiconductor Device App 20160163656 - SUGIURA; Shun ; et al. | 2016-06-09 |
| Semiconductor Device App 20150221566 - Ookura; Yasushi | 2015-08-06 |
| Semiconductor device having both IGBT area and diode area Grant 8,952,449 - Koyama , et al. February 10, 2 | 2015-02-10 |
| Semiconductor device Grant 8,716,746 - Koyama , et al. May 6, 2 | 2014-05-06 |
| Semiconductor module and method of manufacturing the same Grant 8,497,572 - Fukutani , et al. July 30, 2 | 2013-07-30 |
| Semiconductor device including two heat sinks and method of manufacturing the same Grant 8,405,194 - Nishihata , et al. March 26, 2 | 2013-03-26 |
| Semiconductor Device App 20120043581 - KOYAMA; Masaki ; et al. | 2012-02-23 |
| Semiconductor Device Having Both Igbt Area And Diode Area App 20120043582 - KOYAMA; Masaki ; et al. | 2012-02-23 |
| Semiconductor Module And Method Of Manufacturing The Same App 20120001308 - Fukutani; Keita ; et al. | 2012-01-05 |
| Semiconductor device including two heat sinks and method of manufacturing the same App 20100327455 - Nishihata; Masayoshi ; et al. | 2010-12-30 |
| Transfer-molded power device and method for manufacturing transfer-molded power device Grant 7,145,254 - Hirano , et al. December 5, 2 | 2006-12-05 |
| Transfer-molded power device and method for manufacturing transfer-molded power device App 20030022464 - Hirano, Naohiko ; et al. | 2003-01-30 |
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