Ooi; Ping Ping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ooi; Ping Ping.The latest application filed is for "substrate with gradiated dielectric for reducing impedance mismatch".

Company Profile

14.15.24

Ooi; Ping Ping - Butterworth MY
Ooi; Ping Ping - Betterworth MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnect core Grant 11,355,458 - Kong , et al. June 7, 2	2022-06-07
Substrate With Gradiated Dielectric For Reducing Impedance Mismatch App 20220102295 - Kong; Jackson Chung Peng ; et al.	2022-03-31
Integrating System In Package (sip) With Input/output (io) Board For Platform Miniaturization App 20210366883 - Goh; Eng Huat ; et al.	2021-11-25
Substrate with gradiated dielectric for reducing impedance mismatch Grant 11,164,827 - Kong , et al. November 2, 2	2021-11-02
Packaged die stacks with stacked capacitors and methods of assembling same Grant 11,121,074 - Cheah , et al. September 14, 2	2021-09-14
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization Grant 11,114,421 - Goh , et al. September 7, 2	2021-09-07
Composite Bridge Die-to-die Interconnects For Integrated-circuit Packages App 20210183776 - Cheah; Bok Eng ; et al.	2021-06-17
Over-molded IC package with in-mold capacitor Grant 10,998,261 - Kong , et al. May 4, 2	2021-05-04
Multi-conductor interconnect structure for a microelectronic device Grant 10,980,108 - Ooi , et al. April 13, 2	2021-04-13
Stacked dice systems Grant 10,916,524 - Cheah , et al. February 9, 2	2021-02-09
Packaged Die Stacks With Stacked Capacitors And Methods Of Assembling Same App 20210005547 - Cheah; Bok Eng ; et al.	2021-01-07
Packaged die stacks with stacked capacitors and methods of assembling same Grant 10,593,618 - Cheah , et al.	2020-03-17
Multi-conductor Interconnect Structure For A Microelectronic Device App 20200084880 - Ooi; Ping Ping ; et al.	2020-03-12
Stacked Dice Systems App 20200083194 - Cheah; Bok Eng ; et al.	2020-03-12
Microelectronics Package With A Combination Heat Spreader/radio Frequency Shield App 20200027813 - Cheah; Bok Eng ; et al.	2020-01-23
Over-molded IC packages with embedded voltage reference plane and heater spreader Grant 10,541,200 - Ooi , et al. Ja	2020-01-21
Integrating System In Package (sip) With Input/output (io) Board For Platform Miniaturization App 20190378828 - Goh; Eng Huat ; et al.	2019-12-12
Substrate With Gradiated Dielectric For Reducing Impedance Mismatch App 20190355681 - Kong; Jackson Chung Peng ; et al.	2019-11-21
Composite Stacked Interconnects For High-speed Applications And Methods Of Assembling Same App 20190311978 - Cheah; Bok Eng ; et al.	2019-10-10
Stacked package assembly with voltage reference plane Grant 10,403,604 - Cheah , et al. Sep	2019-09-03
Integrating system in package (SIP) with input/output (IO) board for platform miniaturization Grant 10,388,636 - Goh , et al. A	2019-08-20
Apparatus utilizing computer on package construction Grant 10,317,938 - Goh , et al.	2019-06-11
Packaged Die Stacks With Stacked Capacitors And Methods Of Assembling Same App 20190006277 - Cheah; Bok Eng ; et al.	2019-01-03
Over-molded Ic Packages With Embedded Voltage Reference Plane & Heater Spreader App 20180366407 - OOI; Ping Ping ; et al.	2018-12-20
Over-molded Ic Package With In-mold Capacitor App 20180358292 - KONG; Jackson Chung Peng ; et al.	2018-12-13
Integrating System In Package (sip) With Input/output (io) Board For Platform Miniaturization App 20180331081 - Goh; Eng Huat ; et al.	2018-11-15
Stacked Package Assembly With Voltage Reference Plane App 20180294252 - CHEAH; Bok Eng ; et al.	2018-10-11
Embedded Voltage Reference Plane For System-in-package Applications App 20180226357 - Kong; Jackson Chung Peng ; et al.	2018-08-09
Substrate Including Structures To Couple A Capacitor To A Packaged Device And Method Of Making Same App 20170086298 - Chuah; Tin Poay ; et al.	2017-03-23
Hybrid package transmission line circuits Grant 9,543,244 - Kong , et al. January 10, 2	2017-01-10
Apparatus Utilizing Computer On Package Construction App 20160216731 - Goh; Eng Huat ; et al.	2016-07-28
Hybrid Package Transmission Line Circuits App 20150069629 - KONG; Chung Peng Jackson ; et al.	2015-03-12
Hybrid package transmission line circuits Grant 8,890,302 - Kong , et al. November 18, 2	2014-11-18
Hybrid Package Transmission Line Circuits App 20140001643 - KONG; Chung Peng (Jackson) ; et al.	2014-01-02

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