Ooi; Kooi Chi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ooi; Kooi Chi.The latest application filed is for "molded silicon interconnects in bridges for integrated-circuit packages".

Company Profile

26.45.73

Ooi; Kooi Chi - Glugor MY
Ooi; Kooi Chi - Pinang MY
OOI; Kooi Chi - Gelugor Pulau Pinang MY
OOI; Kooi Chi - Gelugor Pulau MY
Ooi; Kooi Chi - Bukit Gambir MY
Ooi; Kooi Chi - Gelugor MY
Ooi; Kooi Chi - Bayan Lepas MY
Ooi; Kooi Chi - Georgetown MY
Ooi; Kooi Chi - Penang MY
Ooi; Kooi Chi - Teluk Kumbar MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Molded Silicon Interconnects In Bridges For Integrated-circuit Packages App 20220302033 - Cheah; Bok Eng ; et al.	2022-09-22
Overhang bridge interconnect Grant 11,430,764 - Cheah , et al. August 30, 2	2022-08-30
Interconnect core Grant 11,355,458 - Kong , et al. June 7, 2	2022-06-07
Vertical power plane module for semiconductor packages Grant 11,342,289 - Ong , et al. May 24, 2	2022-05-24
Substrate With Gradiated Dielectric For Reducing Impedance Mismatch App 20220102295 - Kong; Jackson Chung Peng ; et al.	2022-03-31
Integrated bridge for die-to-die interconnects Grant 11,282,780 - Cheah , et al. March 22, 2	2022-03-22
Electrical Shield For Stacked Heterogeneous Device Integration App 20220068833 - LIM; Seok Ling ; et al.	2022-03-03
Multi-chip Package With Extended Frame App 20220068782 - CHEAH; Bok Eng ; et al.	2022-03-03
Semiconductor Device And Method Of Forming The Same App 20220068821 - CHEAH; Bok Eng ; et al.	2022-03-03
Vertical Power Plane Module For Semiconductor Packages App 20220068846 - ONG; Jenny Shio Yin ; et al.	2022-03-03
Embedded Reference Layers For Semiconductor Package Substrates App 20220068836 - Cheah; Bok Eng ; et al.	2022-03-03
Methods And Apparatus For Allocating A Workload To An Accelerator Using Machine Learning App 20210406085 - Vijayaraghavan; Divya ; et al.	2021-12-30
Vertical Die-to-die Interconnects Bridge App 20210384130 - CHEAH; Bok Eng ; et al.	2021-12-09
Embedded reference layers for semiconductor package substrates Grant 11,195,801 - Cheah , et al. December 7, 2	2021-12-07
Hybrid Ball Grid Array Package For High Speed Interconnects App 20210375735 - Cheah; Bok Eng ; et al.	2021-12-02
Substrate with gradiated dielectric for reducing impedance mismatch Grant 11,164,827 - Kong , et al. November 2, 2	2021-11-02
Opossum Redistribution Frame For Configurable Memory Devices App 20210335718 - CHEAH; Bok Eng ; et al.	2021-10-28
Semiconductor Package With Hybrid Mold Layers App 20210335698 - CHEAH; Bok Eng ; et al.	2021-10-28
Encapsulated Vertical Interconnects For High-speed Applications And Methods Of Assembling Same App 20210217689 - Cheah; Bok Eng ; et al.	2021-07-15
Encapsulated vertical interconnects for high-speed applications and methods of assembling same Grant 11,049,801 - Cheah , et al. June 29, 2	2021-06-29
Overhang Bridge Interconnect App 20210193616 - Cheah; Bok Eng ; et al.	2021-06-24
Integrated Bridge For Die-to-die Interconnects App 20210193567 - Cheah; Bok Eng ; et al.	2021-06-24
Interposer For Hybrid Interconnect Geometry App 20210183755 - Ong; Jenny Shio Yin ; et al.	2021-06-17
Methods and apparatus for allocating a workload to an accelerator using machine learning Grant 11,030,012 - Vijayaraghavan , et al. June 8, 2	2021-06-08
Systems in packages including wide-band phased-array antennas and methods of assembling same Grant 10,978,434 - Cheah , et al. April 13, 2	2021-04-13
Multi-conductor interconnect structure for a microelectronic device Grant 10,980,108 - Ooi , et al. April 13, 2	2021-04-13
Recess By-pass Interconnects App 20210098350 - Cheah; Bok Eng ; et al.	2021-04-01
Electronic packages with stacked sitffeners and methods of assembling same Grant 10,964,677 - Ong , et al. March 30, 2	2021-03-30
Computer-assisted or autonomous driving vehicle incident management method and apparatus Grant 10,948,915 - Qawami , et al. March 16, 2	2021-03-16
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same Grant 10,950,552 - Kong , et al. March 16, 2	2021-03-16
Stacked dice systems Grant 10,916,524 - Cheah , et al. February 9, 2	2021-02-09
Embedded Reference Layers For Semiconductor Package Substrates App 20200168559 - Cheah; Bok Eng ; et al.	2020-05-28
Systems In Packages Including Wide-band Phased-array Antennas And Methods Of Assembling Same App 20200168592 - Cheah; Bok Eng ; et al.	2020-05-28
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same Grant 10,651,127 - Kong , et al.	2020-05-12
Devices And Methods For Signal Integrity Protection Technique App 20200126928 - Cheah; Bok Eng ; et al.	2020-04-23
Flexible computing device that includes a plurality of displays Grant 10,606,316 - Kong , et al.	2020-03-31
Stacked Dice Systems App 20200083194 - Cheah; Bok Eng ; et al.	2020-03-12
Systems in packages including wide-band phased-array antennas and methods of assembling same Grant 10,580,761 - Cheah , et al.	2020-03-03
Microelectronics Package With A Combination Heat Spreader/radio Frequency Shield App 20200027813 - Cheah; Bok Eng ; et al.	2020-01-23
Substrate With Gradiated Dielectric For Reducing Impedance Mismatch App 20190355681 - Kong; Jackson Chung Peng ; et al.	2019-11-21
Stacked package assembly with voltage reference plane Grant 10,403,604 - Cheah , et al. Sep	2019-09-03
Wearable electronic devices and components thereof Grant 10,394,280 - Meyer , et al. A	2019-08-27
Flexible packaging architecture Grant 10,396,038 - Cheah , et al. A	2019-08-27
Ring-in-ring Configurable-capacitance Stiffeners And Methods Of Assembling Same App 20190259704 - Kong; Jackson Chung Peng ; et al.	2019-08-22
Electrical interconnect for a flexible electronic package Grant 10,354,957 - Cheah , et al. July 16, 2	2019-07-16
Systems In Packages Including Wide-band Phased-array Antennas And Methods Of Assembling Same App 20190181126 - Cheah; Bok Eng ; et al.	2019-06-13
Electronic Packages With Stacked Sitffeners And Methods Of Assembling Same App 20190109122 - Ong; Jenny Shio Yin ; et al.	2019-04-11
Ring-in-ring Configurable-capacitance Stiffeners And Methods Of Assembling Same App 20190103359 - Kong; Jackson Chung Peng ; et al.	2019-04-04
Methods And Apparatus For Allocating A Workload To An Accelerator Using Machine Learning App 20190050265 - Vijayaraghavan; Divya ; et al.	2019-02-14
Computer-assisted Or Autonomous Driving Vehicle Incident Management Method And Apparatus App 20190049969 - Qawami; Shekoufeh ; et al.	2019-02-14
Methods And Apparatus To Improve Data Training Of A Machine Learning Model Using A Field Programmable Gate Array App 20190050715 - Ooi; Kooi Chi ; et al.	2019-02-14
Evaluating Risk Factors Of Proposed Vehicle Maneuvers Using External And Internal Data App 20190047559 - CONDE; Naissa ; et al.	2019-02-14
Stacked Dies With Passive Components Within Facing Recesses App 20190013301 - CHEAH; Bok Eng ; et al.	2019-01-10
Electrical Interconnect For A Flexible Electronic Package App 20180350748 - Cheah; Bok Eng ; et al.	2018-12-06
Flexible Computing Device That Includes A Plurality Of Displays App 20180348823 - KONG; Jackson Chung Peng ; et al.	2018-12-06
Stacked Package Assembly With Voltage Reference Plane App 20180294252 - CHEAH; Bok Eng ; et al.	2018-10-11
Embedded Voltage Reference Plane For System-in-package Applications App 20180226357 - Kong; Jackson Chung Peng ; et al.	2018-08-09
Foldable fabric-based packaging solution Grant 10,014,710 - Cheah , et al. July 3, 2	2018-07-03
Wearable Electronic Devices And Components Thereof App 20180157289 - Meyer; Thorsten ; et al.	2018-06-07
High Density Second Level Interconnection For Bumpless Build Up Layer (bbul) Packaging Technology App 20180145014 - Cheah; Bok Eng ; et al.	2018-05-24
Interconnects For Wearable Device App 20180088627 - Cheah; Bok Eng ; et al.	2018-03-29
Wearable electronic devices and components thereof Grant 9,904,321 - Meyer , et al. February 27, 2	2018-02-27
Flexible Packaging Architecture App 20170345763 - CHEAH; Bok Eng ; et al.	2017-11-30
Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same Grant 9,812,425 - Cheah , et al. November 7, 2	2017-11-07
Flexible system-in-package solutions for wearable devices Grant 9,778,688 - Tang , et al. October 3, 2	2017-10-03
High density second level interconnection for bumpless build up layer (BBUL) packaging technology Grant 9,721,878 - Cheah , et al. August 1, 2	2017-08-01
Foldable Fabric-based Packaging Solution App 20170170676 - CHEAH; Bok Eng ; et al.	2017-06-15
Integrated circuit packaging techniques and configurations for small form-factor or wearable devices Grant 9,646,953 - Kong , et al. May 9, 2	2017-05-09
Electrical interconnect for an electronic package Grant 9,552,995 - Yong , et al. January 24, 2	2017-01-24
Multi-die Semiconductor Structure With Intermediate Vertical Side Chip And Semiconductor Package For Same App 20170018530 - CHEAH; Bok Eng ; et al.	2017-01-19
Electrostatic Discharge For Electronic Device Coupling App 20160380386 - Kong; Jackson Chung Peng ; et al.	2016-12-29
Integrated Circuit Packaging Techniques And Configurations For Small Form-factor Or Wearable Devices App 20160343686 - Kong; Jackson Chung Peng ; et al.	2016-11-24
Flexible System-in-package Solutions For Wearable Devices App 20160327977 - Tang; Jiamiao ; et al.	2016-11-10
Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same Grant 9,478,524 - Cheah , et al. October 25, 2	2016-10-25
Wearable Electronic Devices And Components Thereof App 20160274621 - Meyer; Thorsten ; et al.	2016-09-22
Electrostatic Discharge For Electronic Device Coupling App 20160211619 - Kong; Jackson Chung Peng ; et al.	2016-07-21
Electrical Interconnect For An Electronic Package App 20160148866 - Yong; Khang Choong ; et al.	2016-05-26
Multi-die Semiconductor Structure With Intermediate Vertical Side Chip And Semiconductor Package For Same App 20160005718 - CHEAH; Bok Eng ; et al.	2016-01-07
Method to enable controlled side chip interconnection for 3D integrated packaging system Grant 9,136,251 - Cheah , et al. September 15, 2	2015-09-15
High-density Inter-package Connections For Ultra-thin Package-on-package Structures, And Processes Of Forming Same App 20150201497 - Cheah; Bok Eng ; et al.	2015-07-16
High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same Grant 8,987,896 - Cheah , et al. March 24, 2	2015-03-24
Stacked Die Package App 20140175670 - Cheah; Bok Eng ; et al.	2014-06-26
Stacked die package Grant 8,697,495 - Cheah , et al. April 15, 2	2014-04-15
High Density Second Level Interconnection For Bumpless Build Up Layer (bbul) Packaging Technology App 20140091442 - Cheah; Bok Eng ; et al.	2014-04-03
Method To Enable Controlled Side Chip Interconnection For 3d Integrated Packaging System App 20130341803 - Cheah; Bok Eng ; et al.	2013-12-26
Microelectronic Device, Stacked Die Package And Computing System Containing Same, Method Of Manufacturing A Multi-channel Communication Pathway In Same, And Method Of Enabling Electrical Communication Between Components Of A Stacked-die Package App 20120319293 - Cheah; Bok Eng ; et al.	2012-12-20
Firmware verification using system memory error check logic Grant 8,281,229 - Chew , et al. October 2, 2	2012-10-02
Die backside wire bond technology for single or stacked die package Grant 8,198,716 - Periaman , et al. June 12, 2	2012-06-12
Die backside metallization and surface activated bonding for stacked die packages Grant 8,110,930 - Periaman , et al. February 7, 2	2012-02-07
Stacked Die Package App 20120003792 - CHEAH; Bok Eng ; et al.	2012-01-05
Stacked die package Grant 8,044,497 - Cheah , et al. October 25, 2	2011-10-25
High-density Inter-package Connections For Ultra-thin Package-on-package Structures, And Processes Of Forming Same App 20110140268 - Cheah; Bok Eng ; et al.	2011-06-16
Bandwidth allocation for network packet traffic Grant 7,773,504 - Chew , et al. August 10, 2	2010-08-10
Firmware Verification Using System Memory Error Check Logic App 20100169750 - Chew; Yen Hsiang ; et al.	2010-07-01
Quality of service (QoS) processing of data packets Grant 7,743,181 - Chew , et al. June 22, 2	2010-06-22
Stacked-die packages with silicon vias and surface activated bonding Grant 7,692,278 - Periaman , et al. April 6, 2	2010-04-06
Bandwidth allocation for network packet traffic App 20090122702 - Chew; Yen Hsiang ; et al.	2009-05-14
Stacked Die Package App 20090065951 - CHEAH; Bok Eng ; et al.	2009-03-12
Quality of Service (QoS) Processing of Data Packets App 20090019196 - Chew; Yen Hsiang ; et al.	2009-01-15
Vertical Controlled Side Chip Connection For 3d Processor Package App 20080315388 - Periaman; Shanggar ; et al.	2008-12-25
Die backside metallization and surface activated bonding for stacked die packages App 20080315421 - Periaman; Shanggar ; et al.	2008-12-25
Die backside wire bond technology for single or stacked die package App 20080237310 - Periaman; Shanggar ; et al.	2008-10-02
Package on package design to improve functionality and efficiency Grant 7,400,033 - Cheah , et al. July 15, 2	2008-07-15
Package On Package Design To Improve Functionality And Efficiency App 20080157350 - Cheah; Bok Eng ; et al.	2008-07-03
Stacked die semiconductor package Grant 7,279,795 - Periaman , et al. October 9, 2	2007-10-09
Stacked die semiconductor package App 20070152313 - Periaman; Shanggar ; et al.	2007-07-05

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