Onozuka; Hideaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Onozuka; Hideaki.The latest application filed is for "processing abnormality detection method and processing device".

Company Profile

0.6.10

Onozuka; Hideaki - Sagamihara N/A JP
Onozuka; Hideaki - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Machine tool Grant 8,967,927 - Onozuka , et al. March 3, 2	2015-03-03
Processing Abnormality Detection Method and Processing Device App 20140288882 - Nakasu; Nobuaki ; et al.	2014-09-25
Working Abnormality Detecting Device and Working Abnormality Detecting Method for Machine Tool App 20140123740 - Yoshikawa; Takehisa ; et al.	2014-05-08
Machine Tool App 20110085869 - ONOZUKA; Hideaki ; et al.	2011-04-14
Method for estimating self-vibration of milling tool in the operating process Grant 7,810,417 - Onozuka , et al. October 12, 2	2010-10-12
Corner Portion Working Tool App 20100129169 - Kyoi; Masayuki ; et al.	2010-05-27
Tool having damper Grant 7,661,912 - Onozuka , et al. February 16, 2	2010-02-16
Method and program for calculating maximum depth of cut without self-excited vibration of cutting tool Grant 7,500,812 - Onozuka , et al. March 10, 2	2009-03-10
Method for estimating self-vibration of milling tool in the operating process App 20070201956 - Onozuka; Hideaki ; et al.	2007-08-30
Method and program for calculating maximum depth of cut without self-excited vibration of cutting tool App 20070179661 - Onozuka; Hideaki ; et al.	2007-08-02
Tool having damper, cutting method using the same, and manufacturing method of impeller or guide vane of fluid machine App 20060275090 - Onozuka; Hideaki ; et al.	2006-12-07
Sintered body and electrode, method for surface densitication of these, process for manufacturing electrode by this method and circuit breaker Grant 6,753,494 - Asakawa , et al. June 22, 2	2004-06-22
Sintered body and electrode, method for surface densitication of these, process for manufacturing electrode by this method and circuit breaker App 20030015500 - Asakawa, Yohei ; et al.	2003-01-23

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