Onozeki; Hitoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Onozeki; Hitoshi.The latest application filed is for "semiconductor element mounting structure, and combination of semiconductor element and substrate".

Company Profile

2.5.5

Onozeki; Hitoshi - Tokyo JP
ONOZEKI; Hitoshi - Chiyoda-ku Tokyo
Onozeki; Hitoshi - Ibaraki N/A JP
Onozeki; Hitoshi - Chikusei JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor element mounting structure, and combination of semiconductor element and substrate Grant 11,444,054 - Onozeki , et al. September 13, 2	2022-09-13
Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board Grant 10,893,616 - Onozeki , et al. January 12, 2	2021-01-12
Semiconductor Element Mounting Structure, And Combination Of Semiconductor Element And Substrate App 20200273837 - ONOZEKI; Hitoshi ; et al.	2020-08-27
Buffer Sheet Composition And Buffer Sheet App 20180340056 - Koseki; Yuta ; et al.	2018-11-29
Multilayer Printed Wiring Board Production Method, Adhesive Layer-equipped Metal Foil, Metal-clad Laminate, And Multilayer Printed Wiring Board App 20180235090 - ONOZEKI; Hitoshi ; et al.	2018-08-16
Two-layered laminate having metal foil cladded on its one surface, method for production of the laminate, single-sided printed wiring board, and method for production of the wiring board Grant 10,051,743 - Onozeki , et al. August 14, 2	2018-08-14
Two-layered Laminate Having Metal Foil Cladded On Its One Surface, Method For Production Of The Laminate, Single-sided Printed Wiring Board, And Method For Production Of The Wiring Board App 20110108310 - Onozeki; Hitoshi ; et al.	2011-05-12
Adhesion assisting agent fitted metal foil, and printed wiring board using thereof Grant 7,740,936 - Ogawa , et al. June 22, 2	2010-06-22
Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Board Using Thereof App 20080145689 - Ogawa; Nobuyuki ; et al.	2008-06-19

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