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Patent applications and USPTO patent grants for Onozaki; Junichi.The latest application filed is for "heating device, reflow device, heating method, and bump forming method".
Patent | Date |
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Heating device, reflow device, heating method, and bump forming method Grant 8,104,661 - Onozaki , et al. January 31, 2 | 2012-01-31 |
Heater, reflow apparatus, and solder bump forming method and apparatus Grant 8,042,727 - Shirai , et al. October 25, 2 | 2011-10-25 |
Heating Device, Reflow Device, Heating Method, And Bump Forming Method App 20090008432 - Onozaki; Junichi ;   et al. | 2009-01-08 |
Method for supplying solder Grant 7,350,686 - Onozaki , et al. April 1, 2 | 2008-04-01 |
Solder composition and method of bump formation therewith App 20070181218 - Sakamoto; Isao ;   et al. | 2007-08-09 |
Heater, reflow apparatus, and solder bump forming method and apparatus App 20070158387 - Shirai; Masaru ;   et al. | 2007-07-12 |
Method for supplying solder App 20060054667 - Onozaki; Junichi ;   et al. | 2006-03-16 |
Precision machining stage equipment Grant 6,992,407 - Kano , et al. January 31, 2 | 2006-01-31 |
Precision Machining Stage Equipment App 20050219025 - Kano, Yoshio ;   et al. | 2005-10-06 |
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