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Onozaki; Junichi Patent Filings

Onozaki; Junichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Onozaki; Junichi.The latest application filed is for "heating device, reflow device, heating method, and bump forming method".

Company Profile
0.4.5
  • Onozaki; Junichi - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Heating device, reflow device, heating method, and bump forming method
Grant 8,104,661 - Onozaki , et al. January 31, 2
2012-01-31
Heater, reflow apparatus, and solder bump forming method and apparatus
Grant 8,042,727 - Shirai , et al. October 25, 2
2011-10-25
Heating Device, Reflow Device, Heating Method, And Bump Forming Method
App 20090008432 - Onozaki; Junichi ;   et al.
2009-01-08
Method for supplying solder
Grant 7,350,686 - Onozaki , et al. April 1, 2
2008-04-01
Solder composition and method of bump formation therewith
App 20070181218 - Sakamoto; Isao ;   et al.
2007-08-09
Heater, reflow apparatus, and solder bump forming method and apparatus
App 20070158387 - Shirai; Masaru ;   et al.
2007-07-12
Method for supplying solder
App 20060054667 - Onozaki; Junichi ;   et al.
2006-03-16
Precision machining stage equipment
Grant 6,992,407 - Kano , et al. January 31, 2
2006-01-31
Precision Machining Stage Equipment
App 20050219025 - Kano, Yoshio ;   et al.
2005-10-06

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