Ono; Isoroku

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ono; Isoroku.The latest application filed is for "method for manufacturing direct bonded soi wafer and direct bonded soi wafer manufactured by the methond".

Company Profile

0.9.10

Ono; Isoroku - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing semiconductor wafer Grant 8,283,252 - Taniguchi , et al. October 9, 2	2012-10-09
Wafer and method of producing the same Grant 7,951,716 - Morita , et al. May 31, 2	2011-05-31
Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method Grant 7,855,129 - Morita , et al. December 21, 2	2010-12-21
Process for regeneration of a layer transferred wafer and regenerated layer transferred wafer Grant 7,829,436 - Morita , et al. November 9, 2	2010-11-09
Method For Manufacturing Direct Bonded Soi Wafer And Direct Bonded Soi Wafer Manufactured By The Methond App 20100219500 - MORITA; Etsurou ; et al.	2010-09-02
Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method Grant 7,781,309 - Morita , et al. August 24, 2	2010-08-24
Bonded wafer and method of producing the same Grant 7,718,507 - Morita , et al. May 18, 2	2010-05-18
Method for producing bonded wafer Grant 7,713,842 - Nishihata , et al. May 11, 2	2010-05-11
Method of manufacturing semiconductor wafer App 20100009605 - Taniguchi; Toru ; et al.	2010-01-14
Method of manufacturing semiconductor wafer Grant 7,589,023 - Taniguchi , et al. September 15, 2	2009-09-15
Method for producing bonded wafer App 20090098707 - Nishihata; Hideki ; et al.	2009-04-16
Method of polishing semiconductor wafers by using double-sided polisher Grant 7,470,169 - Taniguchi , et al. December 30, 2	2008-12-30
Bonded wafer and method of producing the same App 20070243694 - Morita; Etsurou ; et al.	2007-10-18
Wafer and method of producing the same App 20070197035 - Morita; Etsurou ; et al.	2007-08-23
Process for Regeneration of a Layer Transferred Wafer and Regenerated Layer Transferred Wafer App 20070148917 - Morita; Etsurou ; et al.	2007-06-28
Process for Regeneration of a Layer Transferred Wafer and Regenerated Layer Transferred Wafer App 20070148914 - Morita; Etsurou ; et al.	2007-06-28
Method for Manufacturing Direct Bonded SOI Wafer and Direct Bonded SOI Wafer Manufactured by the Method App 20070148912 - Morita; Etsurou ; et al.	2007-06-28
Method of polishing semiconductor wafers by using double-sided polisher App 20030181141 - Taniguchi, Toru ; et al.	2003-09-25
Method of manufacturing semiconductor wafer App 20030104698 - Taniguchi, Toru ; et al.	2003-06-05

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