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Patent applications and USPTO patent grants for Onizuka; Kenzo.The latest application filed is for "thermosetting resin composition".
Patent | Date |
---|---|
Thermosetting resin composition Grant 11,104,760 - Onizuka , et al. August 31, 2 | 2021-08-31 |
Thermosetting Resin Composition App 20200087445 - ONIZUKA; Kenzo ;   et al. | 2020-03-19 |
Epoxy resin composition, epoxy resin, and cured product Grant 9,574,045 - Yamada , et al. February 21, 2 | 2017-02-21 |
Epoxy Resin Composition, Epoxy Resin, And Cured Product App 20150183924 - Yamada; Teruhisa ;   et al. | 2015-07-02 |
Process for producing low-molecular polyphenylene ether Grant 7,858,726 - Onizuka , et al. December 28, 2 | 2010-12-28 |
Process for Producing Low-Molecular Polyphenylene Ether App 20090018303 - Onizuka; Kenzo ;   et al. | 2009-01-15 |
Epoxy resin composition App 20070093614 - Uchida; Hiroshi ;   et al. | 2007-04-26 |
Porous inorganic fine particles App 20050031896 - Satou, Seiji ;   et al. | 2005-02-10 |
Inorganic porous fine particles App 20050020699 - Isobe, Yasuhide ;   et al. | 2005-01-27 |
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