Onitsuka; Yasuto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Onitsuka; Yasuto.The latest application filed is for "component mounting apparatus and method".

Company Profile

0.7.5

Onitsuka; Yasuto - Osaka N/A JP
Onitsuka; Yasuto - Fukuoka JP
Onitsuka, Yasuto - Fukuoka-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
ACF attachment device and ACF attachment method Grant 8,567,054 - Onitsuka October 29, 2	2013-10-29
Component mounting apparatus and method Grant 8,029,638 - Onitsuka , et al. October 4, 2	2011-10-04
Component Mounting Apparatus And Method App 20100243153 - Onitsuka; Yasuto ; et al.	2010-09-30
Acf Attachment Device And Acf Attachment Method App 20090193650 - Onitsuka; Yasuto	2009-08-06
Method of mounting electronic parts on a flexible printed circuit board Grant 7,107,672 - Onitsuka , et al. September 19, 2	2006-09-19
Bonding method Grant 6,869,491 - Onitsuka March 22, 2	2005-03-22
Bonding method App 20040129364 - Onitsuka, Yasuto	2004-07-08
Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board App 20040027811 - Onitsuka, Yasuto ; et al.	2004-02-12
Method of assembling electronic applications and display devices Grant 6,618,937 - Onitsuka September 16, 2	2003-09-16
Assembly apparatus and assembly method of electronic appliances and display devices App 20020004980 - Onitsuka, Yasuto	2002-01-17
Outer-lead bonding apparatus and method therefor Grant 5,501,004 - Onitsuka March 26, 1	1996-03-26

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