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name:-0.0033638477325439
name:-0.0012898445129395
Onishi; Hideshi Patent Filings

Onishi; Hideshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Onishi; Hideshi.The latest application filed is for "purging agent and purging method using the same".

Company Profile
0.4.8
  • Onishi; Hideshi - Osaka N/A JP
  • Onishi; Hideshi - Osaka-shi JP
  • Onishi; Hideshi - Kurashiki JP
  • Onishi; Hideshi - Okayama JP
  • Onishi; Hideshi - Kurashiki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resin composition and multilayer structural body employing the same
Grant 8,883,920 - Inoue , et al. November 11, 2
2014-11-11
Purging Agent And Purging Method Using The Same
App 20130104937 - Kato; Kenji ;   et al.
2013-05-02
Resin Composition And Multilayer Structural Body Employing The Same
App 20120328866 - Inoue; Noriyoshi ;   et al.
2012-12-27
Method For Production Of Stretched Multilayer Film
App 20100136354 - Taniguchi; Masahiko ;   et al.
2010-06-03
Resin Composition and Multi-Layer Structure Using the Same
App 20090186235 - Onishi; Hideshi ;   et al.
2009-07-23
Resin composition and process for preparing multi-layer structure using the same
Grant 7,332,025 - Shida , et al. February 19, 2
2008-02-19
Resin composition
Grant 7,265,177 - Onishi , et al. September 4, 2
2007-09-04
Laminated article
App 20070148481 - Onishi; Hideshi
2007-06-28
Resin composition and process for preparing multi-layer structure using the same
App 20060047040 - Shida; Mitsuzo ;   et al.
2006-03-02
Resin composition
App 20040143049 - Onishi, Hideshi ;   et al.
2004-07-22

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