loadpatents
name:-0.0046250820159912
name:-0.010165929794312
name:-0.00085186958312988
Ong; Pang Hup Patent Filings

Ong; Pang Hup

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ong; Pang Hup.The latest application filed is for "semiconductor package and method of attaching semiconductor dies to substrates".

Company Profile
0.8.4
  • Ong; Pang Hup - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor package and method of attaching semiconductor dies to substrates
Grant 8,592,258 - Castillo , et al. November 26, 2
2013-11-26
Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process
Grant 8,247,272 - Koh , et al. August 21, 2
2012-08-21
Semiconductor Package And Method Of Attaching Semiconductor Dies To Substrates
App 20120034738 - CASTILLO; Denver Paul C. ;   et al.
2012-02-09
Copper On Organic Solderability Preservative (osp) Interconnect And Enhanced Wire Bonding Process
App 20100025849 - KOH; Yong Chuan ;   et al.
2010-02-04
Semiconductor Package And Method Of Attaching Semiconductor Dies To Substrates
App 20090194871 - Castillo; Denver Paul C. ;   et al.
2009-08-06
High density internal ball grid array integrated circuit package
Grant 6,768,646 - Chen , et al. July 27, 2
2004-07-27
Method of fabricating thin integrated circuit units
Grant 6,468,831 - Leong , et al. October 22, 2
2002-10-22
Thin integrated circuit unit
App 20020000648 - Leong, Chew Weng ;   et al.
2002-01-03
Stacked double sided integrated circuit package
Grant 6,274,929 - Leong , et al. August 14, 2
2001-08-14
Thin chip-size integrated circuit package
Grant 6,091,140 - Toh , et al. July 18, 2
2000-07-18
Chip size integrated circuit package
Grant 6,049,129 - Yew , et al. April 11, 2
2000-04-11

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