Ong; Kang Eu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ong; Kang Eu.The latest application filed is for "stiffener for a package substrate".

Company Profile

2.5.7

Ong; Kang Eu - Penang MY
Ong; Kang Eu - Spg Ampat MY
ONG; Kang Eu - Simpang Ampat MY
Ong; Kang Eu - Gelugor MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lower IC package structure for coupling with an upper IC package to form a package-on-package (PoP) assembly and PoP assembly including such a lower IC package structure Grant 10,879,219 - Wong , et al. December 29, 2	2020-12-29
Stiffener For A Package Substrate App 20190006294 - Ong; Jenny Shio Yin ; et al.	2019-01-03
LOWER IC PACKAGE STRUCTURE FOR COUPLING WITH AN UPPER IC PACKAGE TO FORM A PACKAGE-ON-PACKAGE (PoP) ASSEMBLY AND PoP ASSEMBLY INCLUDING SUCH A LOWER IC PACKAGE STRUCTURE App 20180374833 - Wong; Shaw Fong ; et al.	2018-12-27
Chip Carrier Having Variably-sized Pads App 20170170108 - WONG; Chee Ling ; et al.	2017-06-15
Flip chip assembly process for ultra thin substrate and package on package assembly Grant 9,397,016 - Mong , et al. July 19, 2	2016-07-19
Flip Chip Assembly Process For Ultra Thin Substrate And Package On Package Assembly App 20150076692 - Mong; Weng Khoon ; et al.	2015-03-19
Flip chip assembly process for ultra thin substrate and package on package assembly Grant 8,847,368 - Mong , et al. September 30, 2	2014-09-30
Flip Chip Assembly Process For Ultra Thin Substrate And Package On Package Assembly App 20120319276 - Mong; Weng Khoon ; et al.	2012-12-20
Flip chip assembly process for ultra thin substrate and package on package assembly Grant 8,258,019 - Mong , et al. September 4, 2	2012-09-04
Lower IC Package Structure for Coupling with an Upper IC Package to Form a Package-On-Package (PoP) Assembly and PoP Assembly Including Such a Lower IC Package Structure App 20120159118 - Wong; Shaw Fong ; et al.	2012-06-21
Flip Chip Assembly Process For Ultra Thin Substrate And Package On Package Assembly App 20090321928 - Mong; Weng Khoon ; et al.	2009-12-31

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