| Patent | Date |
|---|
Molded Silicon Interconnects In Bridges For Integrated-circuit Packages
App 20220302033 - Cheah; Bok Eng ; et al. | 2022-09-22 |
Molded Interconnects In Bridges For Integrated-circuit Packages
App 20220278084 - Ong; Jenny Shio Yin ; et al. | 2022-09-01 |
Overhang bridge interconnect
Grant 11,430,764 - Cheah , et al. August 30, 2 | 2022-08-30 |
Semiconductor package with hybrid through-silicon-vias
Grant 11,367,673 - Lim , et al. June 21, 2 | 2022-06-21 |
Vertical power plane module for semiconductor packages
Grant 11,342,289 - Ong , et al. May 24, 2 | 2022-05-24 |
Multi-faceted integrated-circuit dice and packages
Grant 11,289,427 - Cheah , et al. March 29, 2 | 2022-03-29 |
Semiconductor package with co-axial ball-grid-array
Grant 11,284,518 - Kong , et al. March 22, 2 | 2022-03-22 |
Integrated bridge for die-to-die interconnects
Grant 11,282,780 - Cheah , et al. March 22, 2 | 2022-03-22 |
3d Stacked Die Package With Molded Integrated Heat Spreader
App 20220077113 - ONG; Jenny Shio Yin ; et al. | 2022-03-10 |
Molded Power Delivery Interconnect Module For Improved Imax And Power Integrity
App 20220077060 - LIM; Seok Ling ; et al. | 2022-03-10 |
Semiconductor Device And Method Of Forming The Same
App 20220068750 - ONG; Jenny Shio Yin ; et al. | 2022-03-03 |
Embedded Reference Layers For Semiconductor Package Substrates
App 20220068836 - Cheah; Bok Eng ; et al. | 2022-03-03 |
Vertical Power Plane Module For Semiconductor Packages
App 20220068846 - ONG; Jenny Shio Yin ; et al. | 2022-03-03 |
Semiconductor Package With Hybrid Through-silicon-vias
App 20220068764 - LIM; Seok Ling ; et al. | 2022-03-03 |
Stacked Semiconductor Package With Stepped Stiffener
App 20220068841 - ONG; Jenny Shio Yin ; et al. | 2022-03-03 |
Semiconductor Package With Co-axial Ball-grid-array
App 20220071022 - KONG; Jackson Chung Peng ; et al. | 2022-03-03 |
Semiconductor Device And Method Of Forming The Same
App 20220068821 - CHEAH; Bok Eng ; et al. | 2022-03-03 |
Substrate Cores For Warpage Control
App 20220068843 - LIM; Seok Ling ; et al. | 2022-03-03 |
Electrical Shield For Stacked Heterogeneous Device Integration
App 20220068833 - LIM; Seok Ling ; et al. | 2022-03-03 |
Semiconductor System And Method Of Forming Semiconductor System
App 20220068740 - KONG; Jackson Chung Peng ; et al. | 2022-03-03 |
Multi-chip Package With Extended Frame
App 20220068782 - CHEAH; Bok Eng ; et al. | 2022-03-03 |
Stiffener build-up layer package
Grant 11,227,841 - Cheah , et al. January 18, 2 | 2022-01-18 |
Hybrid Boards with Embedded Planes
App 20210410273 - KONG; Jackson Chung Peng ; et al. | 2021-12-30 |
Stiffener shield for device integration
Grant 11,205,622 - Ong , et al. December 21, 2 | 2021-12-21 |
Interposer Structures And Methods For 2.5d And 3d Packaging
App 20210384133 - Ong; Jenny Shio Yin ; et al. | 2021-12-09 |
Asymmetrical Laminated Circuit Boards For Improved Electrical Performance
App 20210385948 - KONG; Jackson Chung Peng ; et al. | 2021-12-09 |
Embedded reference layers for semiconductor package substrates
Grant 11,195,801 - Cheah , et al. December 7, 2 | 2021-12-07 |
Hybrid Ball Grid Array Package For High Speed Interconnects
App 20210375735 - Cheah; Bok Eng ; et al. | 2021-12-02 |
Opossum Redistribution Frame For Configurable Memory Devices
App 20210335718 - CHEAH; Bok Eng ; et al. | 2021-10-28 |
Package with wall-side capacitors
Grant 11,158,568 - Ong , et al. October 26, 2 | 2021-10-26 |
Capacitor Loop Structure
App 20210233875 - ONG; Jenny Shio Yin ; et al. | 2021-07-29 |
Overhang Bridge Interconnect
App 20210193616 - Cheah; Bok Eng ; et al. | 2021-06-24 |
Integrated Bridge For Die-to-die Interconnects
App 20210193567 - Cheah; Bok Eng ; et al. | 2021-06-24 |
Interposer For Hybrid Interconnect Geometry
App 20210183755 - Ong; Jenny Shio Yin ; et al. | 2021-06-17 |
Multi-level Fan-out Interconnects For Integrated-circuit Packages
App 20210183779 - Cheah; Bok Eng ; et al. | 2021-06-17 |
Composite Bridge Die-to-die Interconnects For Integrated-circuit Packages
App 20210183776 - Cheah; Bok Eng ; et al. | 2021-06-17 |
Plane-less voltage reference interconnects
Grant 11,037,874 - Cheah , et al. June 15, 2 | 2021-06-15 |
Capacitor loop structure
Grant 11,031,359 - Ong , et al. June 8, 2 | 2021-06-08 |
Integrated Circuit Packages With Conductive Element Having Cavities Housing Electrically Connected Embedded Components
App 20210167023 - Lim; Seok Ling ; et al. | 2021-06-03 |
Capacitors embedded in stiffeners for small form-factor and methods of assembling same
Grant 10,985,147 - Ong , et al. April 20, 2 | 2021-04-20 |
Stiffener-integrated interconnect bypasses for chip-package apparatus and methods of assembling same
Grant 10,978,407 - Kong , et al. April 13, 2 | 2021-04-13 |
Electronic packages with stacked sitffeners and methods of assembling same
Grant 10,964,677 - Ong , et al. March 30, 2 | 2021-03-30 |
Frame-array Interconnects For Integrated-circuit Packages
App 20210066185 - Lim; Seok Ling ; et al. | 2021-03-04 |
Integrated circuit packages with conductive element having cavities housing electrically connected embedded components
Grant 10,910,325 - Lim , et al. February 2, 2 | 2021-02-02 |
Vertical modular stiffeners for stacked multi-device packages
Grant 10,903,155 - Cheah , et al. January 26, 2 | 2021-01-26 |
Multi-faceted Integrated-circuit Dice And Packages
App 20200395309 - Cheah; Bok Eng ; et al. | 2020-12-17 |
Stacked-device Through-silicon Vias For Semiconductor Packages
App 20200168528 - Cheah; Bok Eng ; et al. | 2020-05-28 |
Multiple-surface Connected Embedded Interconnect Bridge For Semiconductor Package Substrates
App 20200168538 - Ong; Jenny Shio Yin ; et al. | 2020-05-28 |
Embedded Reference Layers For Semiconductor Package Substrates
App 20200168559 - Cheah; Bok Eng ; et al. | 2020-05-28 |
Plane-less Voltage Reference Interconnects
App 20200135639 - Cheah; Bok Eng ; et al. | 2020-04-30 |
Stiffener Build-up Layer Package
App 20200006253 - Cheah; Bok Eng ; et al. | 2020-01-02 |
Stiffener-integrated Interconnect Bypasses For Chip-package Apparatus And Methods Of Assembling Same
App 20200006246 - Kong; Jackson Chung Peng ; et al. | 2020-01-02 |
Stiffener Shield For Device Integration
App 20200006247 - Ong; Jenny Shio Yin ; et al. | 2020-01-02 |
Vertical Modular Stiffeners For Stacked Multi-device Packages
App 20190393141 - Cheah; Bok Eng ; et al. | 2019-12-26 |
Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same
Grant 10,504,854 - Cheah , et al. Dec | 2019-12-10 |
Electronic assembly that includes a substrate bridge
Grant 10,492,299 - Goh , et al. Nov | 2019-11-26 |
Capacitor Loop Structure
App 20190279949 - ONG; Jenny Shio Yin ; et al. | 2019-09-12 |
Semiconductor package with package components disposed on a package substrate within a footprint of a die
Grant 10,396,047 - Ong , et al. A | 2019-08-27 |
Package With Wall-side Capacitors
App 20190244883 - Ong; Jenny Shio Yin ; et al. | 2019-08-08 |
Through-stiffener Inerconnects For Package-on-package Apparatus And Methods Of Assembling Same
App 20190181097 - Cheah; Bok Eng ; et al. | 2019-06-13 |
Electronic Packages With Stacked Sitffeners And Methods Of Assembling Same
App 20190109122 - Ong; Jenny Shio Yin ; et al. | 2019-04-11 |
Stiffener For A Package Substrate
App 20190006294 - Ong; Jenny Shio Yin ; et al. | 2019-01-03 |
Package With Embedded Capacitors
App 20190006356 - Lim; Seok Ling ; et al. | 2019-01-03 |
Capacitors Embedded In Stiffeners For Small Form-factor And Methods Of Assembling Same
App 20190006333 - Ong; Jenny Shio Yin ; et al. | 2019-01-03 |
Interconnects for semiconductor packages
Grant 10,163,777 - Lim , et al. Dec | 2018-12-25 |
Semiconductor Package With Package Components Disposed On A Package Substrate Within A Footprint Of A Die
App 20180366423 - ONG; Jenny Shio Yin ; et al. | 2018-12-20 |
Integrated Circuit Packages With Conductive Element Having Cavities Housing Electrically Connected Embedded Components
App 20180342467 - Lim; Seok Ling ; et al. | 2018-11-29 |
Electronic Assembly That Includes A Substrate Bridge
App 20180324951 - Goh; Penang ; et al. | 2018-11-08 |
Interconnects For Semiconductor Packages
App 20180286804 - LIM; SEOK LING ; et al. | 2018-10-04 |
Package on wide I/O silicon
Grant 9,159,714 - Ong , et al. October 13, 2 | 2015-10-13 |
Package On Wide I/o Silicon
App 20150091180 - ONG; Jenny Shio Yin ; et al. | 2015-04-02 |
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