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Patent applications and USPTO patent grants for Ong; Chin Guan.The latest application filed is for "molding system for applying a uniform clamping pressure onto a substrate".
Patent | Date |
---|---|
Molding system for applying a uniform clamping pressure onto a substrate Grant 10,960,583 - Ho , et al. March 30, 2 | 2021-03-30 |
Molding System For Applying A Uniform Clamping Pressure Onto A Substrate App 20180021993 - HO; Shu Chuen ;   et al. | 2018-01-25 |
Mold cleaning apparatus Grant 6,736,627 - Liu , et al. May 18, 2 | 2004-05-18 |
Mold cleaning apparatus App 20030008027 - Liu, Jie ;   et al. | 2003-01-09 |
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