Omura; Eiichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Omura; Eiichi.The latest application filed is for "heat dissipation structure of semiconductor device".
- Omura; Eiichi - Nara JP
- OMURA; Eiichi - Nara-shi JP
| Patent | Date |
|---|---|
| Heat dissipation structure of semiconductor device Grant 10,304,754 - Nishikawa , et al. | 2019-05-28 |
| Heat Dissipation Structure Of Semiconductor Device App 20190027421 - NISHIKAWA; Takeo ; et al. | 2019-01-24 |
| Heat dissipation structure of semiconductor device Grant 9,997,430 - Omura June 12, 2 | 2018-06-12 |
| Heat Dissipation Structure Of Semiconductor Device App 20170301602 - OMURA; Eiichi | 2017-10-19 |
| Optical coupler having first and second terminal boards and first and second conversion elements Grant 8,410,464 - Omura April 2, 2 | 2013-04-02 |
| Acoustic sensor Grant 8,300,857 - Omura , et al. October 30, 2 | 2012-10-30 |
| Acoustic Sensor App 20110204745 - Omura; Eiichi ; et al. | 2011-08-25 |
| Optical Coupler App 20100270483 - Omura; Eiichi | 2010-10-28 |
| Optical waveguide device Grant 7,283,710 - Sano , et al. October 16, 2 | 2007-10-16 |
| Optical waveguide device App 20060045427 - Sano; Akihiko ; et al. | 2006-03-02 |
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