Omote; Koji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Omote; Koji.The latest application filed is for "casing, electronic device, and casing production method".

Company Profile

2.15.13

Omote; Koji - Isehara JP
Omote; Koji - Kawasaki N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Casing, electronic device, and casing production method Grant 11,306,022 - Omote , et al. April 19, 2	2022-04-19
Casing, Electronic Device, And Casing Production Method App 20190194066 - Omote; Koji ; et al.	2019-06-27
Member, Member Manufacturing Method, Electronic Device, And Electronic Device Manufacturing Method App 20170175312 - Omote; Koji ; et al.	2017-06-22
Plate member for housing, housing, and method of fabricating the same Grant 9,095,050 - Omote , et al. July 28, 2	2015-07-28
Enclosure And Method Of Manufacturing The Same App 20140329038 - Omote; Koji ; et al.	2014-11-06
Enclosure and method of manufacturing the same Grant 8,747,600 - Omote , et al. June 10, 2	2014-06-10
Enclosure And Method Of Manufacturing The Same App 20130243983 - Omote; Koji ; et al.	2013-09-19
Plate Member For Housing, Housing, And Method Of Fabricating The Same App 20120118629 - OMOTE; Koji ; et al.	2012-05-17
Circuit substrate and method for fabricating the same Grant 7,678,695 - Taniguchi , et al. March 16, 2	2010-03-16
Semiconductor system-in-package Grant 7,557,014 - Okamoto , et al. July 7, 2	2009-07-07
Circuit substrate and method for fabricating the same App 20070155174 - Taniguchi; Osamu ; et al.	2007-07-05
Circuit substrate and method for fabricating the same Grant 7,211,899 - Taniguchi , et al. May 1, 2	2007-05-01
Semiconductor system-in-package App 20070065981 - Okamoto; Keishiro ; et al.	2007-03-22
Semiconductor system-in-package Grant 7,176,556 - Okamoto , et al. February 13, 2	2007-02-13
Circuit substrate and method for fabricating the same Grant 7,139,176 - Taniguchi , et al. November 21, 2	2006-11-21
Method of fabricating semiconductor device and semiconductor device Grant 7,049,229 - Omote , et al. May 23, 2	2006-05-23
Method of manufacturing electronic circuit component Grant 6,979,644 - Omote , et al. December 27, 2	2005-12-27
Method of fabricating semiconductor device and semiconductor device App 20050026335 - Omote, Koji ; et al.	2005-02-03
Thin-film circuit substrate Grant 6,768,205 - Taniguchi , et al. July 27, 2	2004-07-27
Method of manufacturing electronic circuit component App 20030200654 - Omote, Koji ; et al.	2003-10-30
Circuit substrate and method for fabricating the same App 20030137056 - Taniguchi, Osamu ; et al.	2003-07-24
Circuit substrate and method for fabricating the same App 20030116857 - Taniguchi, Osamu ; et al.	2003-06-26
Semiconductor system-in-package App 20030080400 - Okamoto, Keishiro ; et al.	2003-05-01
Thin-film circuit substrate and manufacturing method thereof, and a via formed substrate and manufacturing method thereof App 20030045085 - Taniguchi, Osamu ; et al.	2003-03-06
Piezoelectric device and method for fabricating the same, and ink jet printer head and method for fabricating the same Grant 5,962,955 - Tsukada , et al. October 5, 1	1999-10-05
Method of manufacturing a laminated piezoelectric actuator Grant 5,607,535 - Tsukada , et al. March 4, 1	1997-03-04
Method for forming a ceramic circuit substrate Grant 5,575,872 - Tsukada , et al. November 19, 1	1996-11-19

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