Omandam; Glenn

Patent Applications and Registrations

Patent applications and USPTO patent grants for Omandam; Glenn.The latest application filed is for "semiconductor device having an interconnect structure with tsv using encapsulant for structural support".

Company Profile

0.10.10

Omandam; Glenn - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP Grant 9,281,259 - Lin , et al. March 8, 2	2016-03-08
Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support Grant 9,054,083 - Suthiwongsunthorn , et al. June 9, 2	2015-06-09
Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface Grant 8,916,416 - Omandam , et al. December 23, 2	2014-12-23
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20140110861 - Suthiwongsunthorn; Nathapong ; et al.	2014-04-24
Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP App 20140061944 - Lin; Yaojian ; et al.	2014-03-06
Semiconductor device having an interconnect structure with TSV using encapsulant for structural support Grant 8,659,162 - Suthiwongsunthorn , et al. February 25, 2	2014-02-25
Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSP Grant 8,610,286 - Lin , et al. December 17, 2	2013-12-17
Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP App 20130147054 - Lin; Yaojian ; et al.	2013-06-13
Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface App 20130127039 - Omandam; Glenn ; et al.	2013-05-23
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20120013004 - Suthiwongsunthorn; Nathapong ; et al.	2012-01-19
Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support Grant 8,067,308 - Suthiwongsunthorn , et al. November 29, 2	2011-11-29
Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface App 20110012258 - Omandam; Glenn ; et al.	2011-01-20
Semiconductor Device and Method of Forming an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20100308443 - Suthiwongsunthorn; Nathapong ; et al.	2010-12-09
Semiconductor device and method of laser-marking wafers with tape applied to its active surface Grant 7,829,384 - Omandam , et al. November 9, 2	2010-11-09
Semiconductor Device and Method of Laser-Marking Wafers with Tape Applied to its Active Surface App 20090081830 - Omandam; Glenn ; et al.	2009-03-26

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.