| Patent | Date |
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Lightweight Structures Having Increased Structural Integrity and an Ultra-low Coefficient of Thermal Expansion
App 20210402683 - HATWAR; Tukaram K. ; et al. | 2021-12-30 |
Semiconductor devices including back-side integrated circuitry
Grant 9,966,406 - Kirby , et al. May 8, 2 | 2018-05-08 |
Semiconductor Devices Including Back-side Integrated Circuitry
App 20170040375 - Kirby; Kyle K. ; et al. | 2017-02-09 |
Semiconductor devices including back-side integrated circuitry
Grant 9,484,378 - Kirby , et al. November 1, 2 | 2016-11-01 |
Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same
Grant 8,982,469 - Hembree , et al. March 17, 2 | 2015-03-17 |
Semiconductor device having backside redistribution layers and method for fabricating the same
Grant 8,963,292 - Oliver , et al. February 24, 2 | 2015-02-24 |
Semiconductor Devices Including Back-side Integrated Circuitry
App 20140191303 - Kirby; Kyle K. ; et al. | 2014-07-10 |
Semiconductor device fabrication methods
Grant 8,679,933 - Kirby , et al. March 25, 2 | 2014-03-25 |
Method and apparatus providing an imager module with a permanent carrier
Grant 8,680,634 - Borthakur , et al. March 25, 2 | 2014-03-25 |
Semiconductor Constructions and Assemblies and Electronic Systems
App 20130330922 - Oliver; Steve ; et al. | 2013-12-12 |
Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside
Grant 8,531,046 - Pratt , et al. September 10, 2 | 2013-09-10 |
Semiconductor Device Having Backside Redistribution Layers And Method For Fabricating The Same
App 20130181348 - Oliver; Steve ; et al. | 2013-07-18 |
Semiconductor device having backside redistribution layers
Grant 8,395,242 - Oliver , et al. March 12, 2 | 2013-03-12 |
Methods for fabricating and filling conductive vias and conductive vias so formed
Grant 8,294,273 - Akram , et al. October 23, 2 | 2012-10-23 |
Semiconductor Device Fabrication Methods
App 20110287572 - Kirby; Kyle K. ; et al. | 2011-11-24 |
Method and apparatus providing an imager module with a permanent carrier
Grant 8,048,708 - Borthakur , et al. November 1, 2 | 2011-11-01 |
Imagers with contact plugs extending through the substrates thereof and imager fabrication methods
Grant 8,017,982 - Kirby , et al. September 13, 2 | 2011-09-13 |
Methods of Determining X-Y Spatial Orientation of a Semiconductor Substrate Comprising an Integrated Circuit, Methods of Positioning a Semiconductor Substrate Comprising an Integrated Circuit, Methods of Processing a Semiconductor Substrate, and Semiconductor Devices
App 20110204526 - Pratt; Dave ; et al. | 2011-08-25 |
Method And Apparatus Providing An Imager Module With A Permanent Carrier
App 20110204462 - Borthakur; Swarnal ; et al. | 2011-08-25 |
Semiconductor Device Having Backside Redistribution Layers And Method For Fabricating The Same
App 20110169122 - Oliver; Steve ; et al. | 2011-07-14 |
Lens Master Devices, Lens Structures, Imaging Devices, And Methods And Apparatuses Of Making The Same
App 20110157455 - Hembree; David R. ; et al. | 2011-06-30 |
Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices
Grant 7,955,946 - Pratt , et al. June 7, 2 | 2011-06-07 |
Methods For Fabricating And Filling Conductive Vias And Conductive Vias So Formed
App 20110095429 - Akram; Salman ; et al. | 2011-04-28 |
Method for fabricating semiconductor device having backside redistribution layers
Grant 7,932,179 - Oliver , et al. April 26, 2 | 2011-04-26 |
Over-molded glass lenses and method of forming the same
Grant 7,920,342 - Duparre , et al. April 5, 2 | 2011-04-05 |
Thermal embossing of resist reflowed lenses to make aspheric lens master wafer
Grant 7,919,230 - Oliver , et al. April 5, 2 | 2011-04-05 |
Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same
Grant 7,916,396 - Hembree , et al. March 29, 2 | 2011-03-29 |
Methods for fabricating and filling conductive vias and conductive vias so formed
Grant 7,892,972 - Akram , et al. February 22, 2 | 2011-02-22 |
Stamp With Mask Pattern For Discrete Lens Replication
App 20100123260 - Duparre; Jacques ; et al. | 2010-05-20 |
Imaging module with symmetrical lens system and method of manufacture
Grant 7,710,667 - Oliver , et al. May 4, 2 | 2010-05-04 |
Over-molded glass lenses and method of forming the same
App 20100002312 - Duparre; Jacques ; et al. | 2010-01-07 |
Imaging Module With Symmetrical Lens System And Method Of Manufacture
App 20090323206 - Oliver; Steve ; et al. | 2009-12-31 |
Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same
App 20090323195 - Hembree; David R. ; et al. | 2009-12-31 |
Method and apparatus providing an imager module with a permanent carrier
App 20090321863 - Borthakur; Swarnal ; et al. | 2009-12-31 |
Thermal embossing of resist reflowed lenses to make aspheric lens master wafer
App 20090325107 - Oliver; Steve ; et al. | 2009-12-31 |
Semiconductor constructions and assemblies, and electronic systems
Grant 7,626,269 - Oliver , et al. December 1, 2 | 2009-12-01 |
Semiconductor device having backside redistribution layers and method for fabricating the same
App 20090026566 - Oliver; Steve ; et al. | 2009-01-29 |
Imagers With Contact Plugs Extending Through The Substrates Thereof And Imager Fabrication Methods
App 20080308893 - Kirby; Kyle K. ; et al. | 2008-12-18 |
Method of making patterning device, patterning device for making patterned structure, and method of making patterned structure
App 20080309900 - Oliver; Steve ; et al. | 2008-12-18 |
Wafer Level Lens Arrays For Image Sensor Packages And The Like, Image Sensor Packages, And Related Methods
App 20080290435 - Oliver; Steve ; et al. | 2008-11-27 |
Semiconductor constructions and assemblies, electronic systems, and methods of forming semiconductor constructions and assemblies
App 20080006931 - Oliver; Steve ; et al. | 2008-01-10 |
Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices
App 20070269994 - Pratt; Dave ; et al. | 2007-11-22 |
Methods for fabricating and filling conductive vias and conductive vias so formed
App 20070184654 - Akram; Salman ; et al. | 2007-08-09 |
Method and apparatus for forming swimming pool gutters
Grant 3,929,944 - Oliver December 30, 1 | 1975-12-30 |
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