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Patent applications and USPTO patent grants for Oldendorf; John.The latest application filed is for "via heat sink material".
Patent | Date |
---|---|
Via heat sink material Grant 7,592,702 - Lewis , et al. September 22, 2 | 2009-09-22 |
Via Heat Sink Material App 20080023840 - Lewis; J. S. ;   et al. | 2008-01-31 |
Via heat sink material Grant 7,124,931 - Lewis , et al. October 24, 2 | 2006-10-24 |
Via heat sink material App 20050103826 - Lewis, J.S. ;   et al. | 2005-05-19 |
One-piece memory card Grant 5,627,729 - Oldendorf , et al. May 6, 1 | 1997-05-06 |
Gravity latch for surface mount components Grant 5,586,008 - Kozel , et al. December 17, 1 | 1996-12-17 |
Memory card frame and cover kit Grant 5,505,628 - Ramey , et al. April 9, 1 | 1996-04-09 |
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