Okuzono; Takahisa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okuzono; Takahisa.The latest application filed is for "device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium".
- Okuzono; Takahisa - Tokyo JP
| Patent | Date |
|---|---|
| Method and apparatus for processing a substrate Grant 11,371,155 - Okuzono , et al. June 28, 2 | 2022-06-28 |
| Device For Measuring Bump Height, Apparatus For Processing Substrate, Method Of Measuring Bump Height, And Storage Medium App 20210285893 - Okuzono; Takahisa ; et al. | 2021-09-16 |
| Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium Grant 10,910,334 - Okuzono , et al. February 2, 2 | 2021-02-02 |
| Method And Apparatus For Processing A Substrate App 20200080218 - Okuzono; Takahisa ; et al. | 2020-03-12 |
| Method and apparatus for processing a substrate Grant 10,508,352 - Okuzono , et al. Dec | 2019-12-17 |
| Device For Inspecting A Bump Height, Device For Processing A Substrate, Method For Inspecting A Bump Height, And Storage Medium App 20190348384 - OKUZONO; Takahisa ; et al. | 2019-11-14 |
| Method And Apparatus For Processing A Substrate App 20180179656 - Okuzono; Takahisa ; et al. | 2018-06-28 |
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