Okuzawa; Nobuyuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okuzawa; Nobuyuki.The latest application filed is for "coil component and manufacturing method therefor".
Company Profile
5.23.26
- Okuzawa; Nobuyuki - Tokyo JP
- Okuzawa; Nobuyuki - Chuo-ku JP
Patent Activity
| Patent | Date |
|---|---|
| Dielectric composition and electronic component Grant 11,380,482 - Suzuki , et al. July 5, 2 | 2022-07-05 |
| Coil Component App 20220130601 - OKUZAWA; Nobuyuki ; et al. | 2022-04-28 |
| Coil Component And Manufacturing Method Therefor App 20220130595 - OKUZAWA; Nobuyuki ; et al. | 2022-04-28 |
| Coil Component And Manufacturing Method Therefor App 20220130596 - OKUZAWA; Nobuyuki ; et al. | 2022-04-28 |
| Dielectric Composition And Electronic Component App 20210012961 - SUZUKI; Shota ; et al. | 2021-01-14 |
| Dielectric Composition And Electronic Component App 20200294687 - SUZUKI; Shota ; et al. | 2020-09-17 |
| Method of manufacturing layered chip package Grant 8,513,034 - Sasaki , et al. August 20, 2 | 2013-08-20 |
| Layered chip package with wiring on the side surfaces Grant 8,324,741 - Sasaki , et al. December 4, 2 | 2012-12-04 |
| Layered chip package with heat sink Grant 8,154,116 - Sasaki , et al. April 10, 2 | 2012-04-10 |
| Layered chip package Grant 8,134,229 - Sasaki , et al. March 13, 2 | 2012-03-13 |
| Electronic component and method of manufacturing the same Grant 8,050,045 - Okuzawa , et al. November 1, 2 | 2011-11-01 |
| Layered chip package with wiring on the side surfaces App 20110221073 - Sasaki; Yoshitaka ; et al. | 2011-09-15 |
| Method of manufacturing layered chip package App 20110201137 - Sasaki; Yoshitaka ; et al. | 2011-08-18 |
| Layered chip package with wiring on the side surfaces Grant 7,968,374 - Sasaki , et al. June 28, 2 | 2011-06-28 |
| Layered chip package and method of manufacturing same Grant 7,964,976 - Sasaki , et al. June 21, 2 | 2011-06-21 |
| Method of manufacturing a coil component Grant 7,905,008 - Yoshida , et al. March 15, 2 | 2011-03-15 |
| Layered chip package and method of manufacturing same Grant 7,868,442 - Sasaki , et al. January 11, 2 | 2011-01-11 |
| Method of manufacturing layered chip package Grant 7,863,095 - Sasaki , et al. January 4, 2 | 2011-01-04 |
| Layered chip package App 20100327464 - Sasaki; Yoshitaka ; et al. | 2010-12-30 |
| Layered chip package and method of manufacturing same Grant 7,846,772 - Sasaki , et al. December 7, 2 | 2010-12-07 |
| Method of manufacturing layered chip package App 20100304531 - Sasaki; Yoshitaka ; et al. | 2010-12-02 |
| Layered chip package and method of manufacturing same App 20100200977 - Sasaki; Yoshitaka ; et al. | 2010-08-12 |
| Method of manufacturing layered chip package Grant 7,767,494 - Sasaki , et al. August 3, 2 | 2010-08-03 |
| Layered chip package and method of manufacturing same Grant 7,745,259 - Sasaki , et al. June 29, 2 | 2010-06-29 |
| Layered chip package with heat sink App 20100109137 - Sasaki; Yoshitaka ; et al. | 2010-05-06 |
| Thin film device and method for manufacturing the same Grant 7,683,269 - Yoshizawa , et al. March 23, 2 | 2010-03-23 |
| Layered chip package and method of manufacturing same App 20100044879 - Sasaki; Yoshitaka ; et al. | 2010-02-25 |
| Layered chip package and method of manufacturing same App 20090321957 - Sasaki; Yoshitaka ; et al. | 2009-12-31 |
| Method of manufacturing layered chip package App 20090325345 - Sasaki; Yoshitaka ; et al. | 2009-12-31 |
| Layered chip package and method of manufacturing same App 20090321956 - Sasaki; Yoshitaka ; et al. | 2009-12-31 |
| Layered chip package and method of manufacturing same App 20090315189 - Sasaki; Yoshitaka ; et al. | 2009-12-24 |
| Thin-film Capacitor App 20090244808 - OHTSUKA; Takashi ; et al. | 2009-10-01 |
| Layered chip package that implements memory device Grant 7,557,439 - Sasaki , et al. July 7, 2 | 2009-07-07 |
| Thin Film Device And Method For Manufacturing The Same App 20080236885 - YOSHIZAWA; Toshiyuki ; et al. | 2008-10-02 |
| Common mode choke coil and method of manufacturing the same Grant 7,414,508 - Okuzawa , et al. August 19, 2 | 2008-08-19 |
| Coil component and method of manufacturing the same Grant 7,397,334 - Yoshida , et al. July 8, 2 | 2008-07-08 |
| Method of manufacturing coil component Grant 7,318,269 - Yoshida , et al. January 15, 2 | 2008-01-15 |
| Coil component Grant 7,283,028 - Yoshida , et al. October 16, 2 | 2007-10-16 |
| Coil component and method of manufacturing the same Grant 7,221,250 - Yoshida , et al. May 22, 2 | 2007-05-22 |
| Common mode choke coil and method of manufacturing the same App 20070075819 - Okuzawa; Nobuyuki ; et al. | 2007-04-05 |
| Electronic component and method of manufacturing the same App 20070040163 - Okuzawa; Nobuyuki ; et al. | 2007-02-22 |
| Coil component and method of manufacturing the same App 20070033798 - Yoshida; Makoto ; et al. | 2007-02-15 |
| Coil component and method of manufacturing the same Grant 7,145,427 - Yoshida , et al. December 5, 2 | 2006-12-05 |
| Coil component and method of manufacturing the same App 20050195062 - Yoshida, Makoto ; et al. | 2005-09-08 |
| Coil component and method of manufacturing the same App 20050184848 - Yoshida, Makoto ; et al. | 2005-08-25 |
| Coil component and method of manufacturing the same App 20050068148 - Yoshida, Makoto ; et al. | 2005-03-31 |
| Method of manufacturing coil component App 20050050717 - Yoshida, Makoto ; et al. | 2005-03-10 |
| Coil component App 20050030144 - Yoshida, Makoto ; et al. | 2005-02-10 |
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