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Patent applications and USPTO patent grants for OKUTSU; Fumitake.The latest application filed is for "semiconductor module, method for manufacturing same, and semiconductor module mounting body".
Patent | Date |
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Semiconductor Module, Method For Manufacturing Same, And Semiconductor Module Mounting Body App 20220271006 - OKUTSU; Fumitake | 2022-08-25 |
Semiconductor Module And Manufacturing Method Therefor App 20220223531 - MASUDA; Takatoshi ;   et al. | 2022-07-14 |
Semiconductor Module, Semiconductor Member, And Method For Manufacturing The Same App 20220139439 - OKUTSU; Fumitake ;   et al. | 2022-05-05 |
Semiconductor module, DIMM module, manufacturing method of semiconductor module, and manufacturing method of DIMM module Grant 11,183,484 - Okutsu , et al. November 23, 2 | 2021-11-23 |
Semiconductor Module, Dimm Module, Manufacturing Method Of Semiconductor Module, And Manufacturing Method Of Dimm Module App 20210143129 - OKUTSU; Fumitake ;   et al. | 2021-05-13 |
Semiconductor Module App 20200357746 - KOSHIKAWA; Yasuji ;   et al. | 2020-11-12 |
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