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OKUTSU; Fumitake Patent Filings

OKUTSU; Fumitake

Patent Applications and Registrations

Patent applications and USPTO patent grants for OKUTSU; Fumitake.The latest application filed is for "semiconductor module, method for manufacturing same, and semiconductor module mounting body".

Company Profile
1.1.5
  • OKUTSU; Fumitake - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Module, Method For Manufacturing Same, And Semiconductor Module Mounting Body
App 20220271006 - OKUTSU; Fumitake
2022-08-25
Semiconductor Module And Manufacturing Method Therefor
App 20220223531 - MASUDA; Takatoshi ;   et al.
2022-07-14
Semiconductor Module, Semiconductor Member, And Method For Manufacturing The Same
App 20220139439 - OKUTSU; Fumitake ;   et al.
2022-05-05
Semiconductor module, DIMM module, manufacturing method of semiconductor module, and manufacturing method of DIMM module
Grant 11,183,484 - Okutsu , et al. November 23, 2
2021-11-23
Semiconductor Module, Dimm Module, Manufacturing Method Of Semiconductor Module, And Manufacturing Method Of Dimm Module
App 20210143129 - OKUTSU; Fumitake ;   et al.
2021-05-13
Semiconductor Module
App 20200357746 - KOSHIKAWA; Yasuji ;   et al.
2020-11-12

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