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Patent applications and USPTO patent grants for Okunoyama; Hikaru.The latest application filed is for "semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles".
Patent | Date |
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Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles Grant 5,113,241 - Yanagida , et al. May 12, 1 | 1992-05-12 |
Electric implement coated with electrically insulating material and the method of applying said electric insulation Grant 4,472,482 - Sato , et al. September 18, 1 | 1984-09-18 |
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