| Patent | Date |
|---|
Curable Composition And Electronic Device
App 20210317251 - OKUHIRA; Hiroyuki | 2021-10-14 |
Butt Welded Joint Of Steel Material And Method For Manufacturing Same
App 20210260699 - OKUHIRA; Hiroyuki ; et al. | 2021-08-26 |
Curable Resin Composition And Electrical Component Using The Same
App 20210002413 - OKUHIRA; Hiroyuki ; et al. | 2021-01-07 |
Curable Resin Composition And Electrical Component Using The Same
App 20200362166 - TAKAKURA; Akira ; et al. | 2020-11-19 |
Curable Resin Composition And Eletrical Component Using The Same
App 20200291170 - OKUHIRA; Hiroyuki ; et al. | 2020-09-17 |
Curable polyurethane type resin composition and electrical device using the same
Grant 10,717,867 - Okuhira , et al. | 2020-07-21 |
Corrosion-resistant Member
App 20200085236 - OKUHIRA; Hiroyuki | 2020-03-19 |
Hydraulic cylinder
Grant 10,480,546 - Okuhira , et al. Nov | 2019-11-19 |
Resin-sealed Component And Method For Producing Same
App 20190344483 - OKUHIRA; Hiroyuki ; et al. | 2019-11-14 |
Electric actuator
Grant 10,385,948 - Nakayama , et al. A | 2019-08-20 |
Curable Polyurethane Type Resin Composition And Electrical Device Using The Same
App 20190144668 - OKUHIRA; Hiroyuki ; et al. | 2019-05-16 |
Electronic device and method for manufacturing the same
Grant 9,789,637 - Izumi , et al. October 17, 2 | 2017-10-17 |
Hydraulic Cylinder
App 20170284428 - OKUHIRA; Hiroyuki ; et al. | 2017-10-05 |
Electric Actuator
App 20170211671 - NAKAYAMA; Toru ; et al. | 2017-07-27 |
Resin additive, polyphenylene sulfide resin composition, and electronic device
Grant 9,290,638 - Okuhira , et al. March 22, 2 | 2016-03-22 |
Electrical Component
App 20160001528 - TAKAKURA; Akira ; et al. | 2016-01-07 |
Curable Resin, Sealing Member, And Electronic Device Product Using Sealing Member
App 20150166728 - OKUHIRA; Hiroyuki ; et al. | 2015-06-18 |
Electronic Device And Method For Manufacturing The Same
App 20150158221 - Izumi; Ryosuke ; et al. | 2015-06-11 |
Hardening Resin Composition, Sealing Material, And Electronic Device Using The Sealing Material
App 20140264959 - Okuhira; Hiroyuki ; et al. | 2014-09-18 |
Resin Additive, Polyphenylene Sulfide Resin Composition, And Electronic Device
App 20140262414 - Okuhira; Hiroyuki ; et al. | 2014-09-18 |
Epoxy Resin Composition And Manufacturing Method Of Bonding Structure
App 20140150973 - Okuhira; Hiroyuki ; et al. | 2014-06-05 |
Epoxy resin composition for fiber reinforced composite material
Grant 8,668,983 - Kawazoe , et al. March 11, 2 | 2014-03-11 |
Covering member for preventing erosion
Grant 8,580,407 - Okuhira November 12, 2 | 2013-11-12 |
Covering Member For Preventing Erosion
App 20110311837 - Okuhira; Hiroyuki | 2011-12-22 |
Reactor For Electrical Devices
App 20100245016 - Kameda; Mitsutoshi ; et al. | 2010-09-30 |
Polymerization-curable composition, method for polymerization curing thereof, and polymerization-cured resin composition
App 20100099805 - Okuhira; Hiroyuki ; et al. | 2010-04-22 |
Epoxy Resin Composition For Fiber Reinforced Composite Material
App 20100062211 - Kawazoe; Masayuki ; et al. | 2010-03-11 |
Modified Conjugated Diene-based Polymer Rubber And Rubber Composition Containing The Same
App 20090143525 - Ashiura; Makoto ; et al. | 2009-06-04 |
Moisture-curable resin composition
App 20070149727 - Okuhira; Hiroyuki ; et al. | 2007-06-28 |
Curable resin composition
Grant 7,223,821 - Okuhira , et al. May 29, 2 | 2007-05-29 |
Curing component and curable resin composition containing the curing component
Grant 7,189,770 - Okuhira , et al. March 13, 2 | 2007-03-13 |
Compound having thermally dissociatable thioacetal skeleton, precursor thereof, cured product thereof, and composition for their production
Grant 7,105,630 - Choi , et al. September 12, 2 | 2006-09-12 |
Guide-equipped cylinder
App 20060054438 - Asaba; Tsuyoshi ; et al. | 2006-03-16 |
One-part, room temperature moisture curable resin composition
Grant 6,936,676 - Okuhira , et al. August 30, 2 | 2005-08-30 |
Curable resin composition
App 20050171318 - Okuhira, Hiroyuki ; et al. | 2005-08-04 |
Curable resin composition
App 20050085596 - Okuhira, Hiroyuki | 2005-04-21 |
One-part, room temperature moisture curable resin composition
App 20040192873 - Okuhira, Hiroyuki ; et al. | 2004-09-30 |
Composition of polyepoxide and oxazolidine latent curing agent
Grant 6,794,479 - Okuhira , et al. September 21, 2 | 2004-09-21 |
Curable resin composition
App 20040167275 - Okuhira, Hiroyuki ; et al. | 2004-08-26 |
One-part, room temperature moisture curable resin composition
Grant 6,756,466 - Okuhira , et al. June 29, 2 | 2004-06-29 |
Curing component and curable resin composition containing the curing component
App 20040116644 - Okuhira, Hiroyuki ; et al. | 2004-06-17 |
One-part, room temperature moisture curable resin composition
App 20040106766 - Okuhira, Hiroyuki ; et al. | 2004-06-03 |
Compound having thermally dissociatable thioacetal skeleton, precursor therefor, cured article, and composition for producing these
App 20040014935 - Choi, Wonmun ; et al. | 2004-01-22 |
Curable compounds, curable resin compositions containing the same and methods of easily disassembling cured materials
Grant 6,670,445 - Okuhira December 30, 2 | 2003-12-30 |
One-part, room temperature moisture curable resin composition
App 20030139559 - Okuhira, Hiroyuki ; et al. | 2003-07-24 |
Novel latent curing agent and moisture-curable epoxy resin composition
App 20030100676 - Okuhira, Hiroyuki ; et al. | 2003-05-29 |
Curable resin composition
App 20030060561 - Okuhira, Hiroyuki ; et al. | 2003-03-27 |
Curable resin composition and novel latent curing agent
App 20020183461 - Okuhira, Hiroyuki ; et al. | 2002-12-05 |
Curable compounds, curable resin compositions containing the same and methods of easily disassembling cured materials
App 20020183449 - Okuhira, Hiroyuki | 2002-12-05 |
One-pack composition of epoxy resin(s) with no oh groups and ketimine
Grant 6,476,160 - Okuhira , et al. November 5, 2 | 2002-11-05 |
Novel latent curing agent and moisture-curable epoxy resin composition
App 20010041782 - Okuhira, Hiroyuki ; et al. | 2001-11-15 |
One-part moisture curable composition
Grant 6,271,333 - Okuhira August 7, 2 | 2001-08-07 |
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