Okudaira; Hiroaki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okudaira; Hiroaki.The latest application filed is for "pb-free solder-connected structure".
- Okudaira; Hiroaki - Yokohama JP
| Patent | Date |
|---|---|
| Pb-free solder-connected structure Grant 8,907,475 - Shimokawa , et al. December 9, 2 | 2014-12-09 |
| Pb-FREE SOLDER-CONNECTED STRUCTURE App 20130286621 - SHIMOKAWA; Hanae ; et al. | 2013-10-31 |
| Pb-free solder-connected structure and electronic device Grant 8,503,189 - Shimokawa , et al. August 6, 2 | 2013-08-06 |
| Pb-free solder-connected structure and electronic device App 20100214753 - SHIMOKAWA; Hanae ; et al. | 2010-08-26 |
| Pb-free solder-connected structure and electronic device Grant 7,709,746 - Shimokawa , et al. May 4, 2 | 2010-05-04 |
| Pb-free solder-connected structure and electronic device App 20060115994 - Shimokawa; Hanae ; et al. | 2006-06-01 |
| Method of producing an electronic device having a PB free solder connection Grant 7,013,564 - Shimokawa , et al. March 21, 2 | 2006-03-21 |
| Pb-free solder-connected structure and electronic device Grant 6,960,396 - Shimokawa , et al. November 1, 2 | 2005-11-01 |
| Pb-free solder-connected structure and electronic device App 20020163085 - Shimokawa, Hanae ; et al. | 2002-11-07 |
| Pb-free solder-connected structure and electronic device App 20020019077 - Shimokawa, Hanae ; et al. | 2002-02-14 |
| Technical field App 20020009610 - Shimokawa, Hanae ; et al. | 2002-01-24 |
| Electronic device plated with gold by means of an electroless gold plating solution Grant 4,963,974 - Ushio , et al. October 16, 1 | 1990-10-16 |
| Magnetic recording medium having an amorphous, nonmagnetic nickel-tungston-phosphorus underlayer Grant 4,735,853 - Okudaira , et al. April 5, 1 | 1988-04-05 |
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