Okuda; Hidehiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okuda; Hidehiko.The latest application filed is for "method of producing bonded substrate".
- Okuda; Hidehiko - Imari JP
- OKUDA; Hidehiko - Tokyo JP
- Okuda; Hidehiko - Yamagata JP
- Okuda; Hidehiko - Imari-shi JP
| Patent | Date |
|---|---|
| P-type silicon wafer and method for heat-treating the same Grant 7,939,441 - Kusaba , et al. May 10, 2 | 2011-05-10 |
| Method Of Producing Bonded Substrate App 20110065258 - OKUDA; Hidehiko ; et al. | 2011-03-17 |
| Method of manufacturing bonded wafer Grant 7,767,549 - Okuda , et al. August 3, 2 | 2010-08-03 |
| Process for regenerating layer transferred wafer Grant 7,763,541 - Okuda , et al. July 27, 2 | 2010-07-27 |
| Method for producing bonded wafer Grant 7,745,306 - Okuda , et al. June 29, 2 | 2010-06-29 |
| Method For Producing Bonded Wafer App 20100144131 - Okuda; Hidehiko | 2010-06-10 |
| P-type Silicon Wafer And Method For Heat-treating The Same App 20090233420 - Kusaba; Tatsumi ; et al. | 2009-09-17 |
| Method for producing bonded wafer App 20090186464 - Morimoto; Nobuyuki ; et al. | 2009-07-23 |
| P-type silicon wafer and method for heat-treating the same Grant 7,541,663 - Kusaba , et al. June 2, 2 | 2009-06-02 |
| Method of manufacturing bonded wafer App 20080213974 - OKUDA; Hidehiko ; et al. | 2008-09-04 |
| Method for manufacturing SOI substrate Grant 7,416,960 - Endo , et al. August 26, 2 | 2008-08-26 |
| Process for Regenerating Layer Transferred Wafer and Layer Transferred Wafer Regenerated by the Process App 20080124929 - Okuda; Hidehiko ; et al. | 2008-05-29 |
| Method for manufacturing SOI substrate Grant 7,364,984 - Endo , et al. April 29, 2 | 2008-04-29 |
| Method for manufacturing SOI substrate Grant 7,354,844 - Endo , et al. April 8, 2 | 2008-04-08 |
| Method for producing bonded wafer App 20080020514 - Okuda; Hidehiko ; et al. | 2008-01-24 |
| Method for Manufacturing SOI Substrate App 20080014716 - Endo; Akihiko ; et al. | 2008-01-17 |
| Method for Manufacturing SOI Substrate App 20080014717 - Endo; Akihiko ; et al. | 2008-01-17 |
| Method for heat-treating silicon wafer and silicon wafer Grant 7,311,775 - Kusaba , et al. December 25, 2 | 2007-12-25 |
| Method for manufacturing SOI substrate App 20060177993 - Endo; Akihiko ; et al. | 2006-08-10 |
| P-type silicon wafer and method for heat-treating the same App 20060027897 - Kusaba; Tatsumi ; et al. | 2006-02-09 |
| Method for heat-treating silicon wafer and silicon wafer App 20060027161 - Kusaba; Tatsumi ; et al. | 2006-02-09 |
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