loadpatents
name:-0.036130905151367
name:-0.023406982421875
name:-0.0061831474304199
OKUBO; Kazuya Patent Filings

OKUBO; Kazuya

Patent Applications and Registrations

Patent applications and USPTO patent grants for OKUBO; Kazuya.The latest application filed is for "flame-resistant layered molded article".

Company Profile
5.24.31
  • OKUBO; Kazuya - Nagoya-shi JP
  • Okubo; Kazuya - Yokohama JP
  • Okubo; Kazuya - Nagoya JP
  • OKUBO; Kazuya - Shiga JP
  • Okubo; Kazuya - Tokyo JP
  • OKUBO; Kazuya - Kanagawa JP
  • Okubo; Kazuya - Hiratsuka JP
  • Okubo; Kazuya - Kyotanabe JP
  • Okubo; Kazuya - Hiratsuka-shi JP
  • Okubo; Kazuya - Kyotanabe-shi JP
  • Okubo; Kazuya - Kawasaki N/A JP
  • Okubo; Kazuya - Seattle WA
  • Okubo; Kazuya - Tokyo-To JP
  • Okubo, Kazuya - Nagoya City JP
  • Okubo; Kazuya - Nirasaki JP
  • Okubo, Kazuya - Nirasaki-shi JP
  • Okubo, Kazuya - Yamanashi-ken JP
  • Okubo; Kazuya - Nakakoma-gun JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Flame-resistant Layered Molded Article
App 20220266578 - WADA; Makoto ;   et al.
2022-08-25
Semiconductor Device
App 20220077141 - Okubo; Kazuya
2022-03-10
Semiconductor Device
App 20220077138 - OKUBO; Kazuya
2022-03-10
Pipe-shaped integrally molded article and production method for pipe-shaped integrally molded article
Grant 11,241,818 - Suzuki , et al. February 8, 2
2022-02-08
Polyphenylene Sulfide Resin Composition And Molded Article
App 20220010073 - Tokuzumi; Keita ;   et al.
2022-01-13
Pretensioner And Seat Belt Apparatus
App 20200254964 - Kind Code
2020-08-13
Pipe-shaped Integrally Molded Article And Production Method For Pipe-shaped Integrally Molded Article
App 20200247028 - Kind Code
2020-08-06
Methods To Reshape Spacer Profiles In Self-aligned Multiple Patterning
App 20200194261 - Ko; Akiteru ;   et al.
2020-06-18
Semiconductor Device
App 20190081032 - OKUBO; Kazuya
2019-03-14
Method for measuring resistance of conveyor belt to getting over support roller, and device therefor
Grant 9,823,180 - Amano , et al. November 21, 2
2017-11-21
Film forming method and film forming apparatus
Grant 9,551,068 - Kumagai , et al. January 24, 2
2017-01-24
Brake disc
Grant 9,188,177 - Fujii , et al. November 17, 2
2015-11-17
Film Forming Method And Film Forming Apparatus
App 20150315705 - KUMAGAI; Takeshi ;   et al.
2015-11-05
Method for Measuring Resistance of Conveyor Belt to Getting Over Support Roller, and Device Therefor
App 20150241332 - Amano; Shigehiko ;   et al.
2015-08-27
Polyphenylene sulfide resin composition and molding comprising same
Grant 9,074,096 - Okubo , et al. July 7, 2
2015-07-07
Method for manufacturing semiconductor device
Grant 8,889,505 - Akiyama , et al. November 18, 2
2014-11-18
Brake Disc
App 20140326550 - Fujii; Toru ;   et al.
2014-11-06
Polyphenylene Sulfide Resin Composition And Molding Comprising Same (as Amended)
App 20140100306 - Okubo; Kazuya ;   et al.
2014-04-10
Method For Manufacturing Semiconductor Device
App 20140004711 - Akiyama; Shinichi ;   et al.
2014-01-02
Semiconductor device and manufacturing method of the semiconductor device
Grant 8,575,704 - Haneda , et al. November 5, 2
2013-11-05
Method for manufacturing semiconductor device
Grant 8,551,832 - Akiyama , et al. October 8, 2
2013-10-08
Method of manufacturing a semiconductor device and semiconductor device
Grant 8,536,708 - Akiyama , et al. September 17, 2
2013-09-17
Method Of Manufacturing A Semiconductor Device And Semiconductor Device
App 20120326315 - Akiyama; Shinichi ;   et al.
2012-12-27
Method of manufacturing a semiconductor device and semiconductor device
Grant 8,338,953 - Akiyama , et al. December 25, 2
2012-12-25
Semiconductor Device And Manufacturing Method Of The Semiconductor Device
App 20120261760 - Haneda; Masaki ;   et al.
2012-10-18
Method for manufacturing semiconductor device
Grant 8,148,262 - Akiyama , et al. April 3, 2
2012-04-03
Method Of Manufacturing A Semiconductor Device And Semiconductor Device
App 20110241211 - AKIYAMA; Shinichi ;   et al.
2011-10-06
Method of manufacturing a semiconductor device and semiconductor device
Grant 8,030,207 - Akiyama , et al. October 4, 2
2011-10-04
Event notifications relating to system failures in scalable systems
Grant 7,984,453 - Alverson , et al. July 19, 2
2011-07-19
Semiconductor Device And Method For Manufacturing The Same
App 20110169105 - OKUBO; Kazuya
2011-07-14
Method For Manufacturing Semiconductor Device
App 20100330812 - Akiyama; Shinichi ;   et al.
2010-12-30
Method For Manufacturing Semiconductor Device
App 20100330764 - Akiyama; Shinichi ;   et al.
2010-12-30
Semiconductor Device Containing Thin Film Capacitor And Manufacture Method For Thin Film Capacitor
App 20090316332 - OKUBO; Kazuya ;   et al.
2009-12-24
Method of forming tungsten film
Grant 7,592,256 - Okubo , et al. September 22, 2
2009-09-22
Semiconductor device
App 20090085130 - Suzuki; Kenji ;   et al.
2009-04-02
Method Of Manufacturing Semiconductor Device
App 20090075477 - KAWAMURA; Kazuo ;   et al.
2009-03-19
Method Of Manufacturing A Semiconductor Device And Semiconductor Device
App 20080284027 - AKIYAMA; Shinichi ;   et al.
2008-11-20
Event Notifications Relating To System Failures In Scalable Systems
App 20080134213 - Alverson; Gail A. ;   et al.
2008-06-05
Method for fabricating a silicide film, multilayered intermediate structure and multilayered structure
App 20050189652 - Nakatsuka, Osamu ;   et al.
2005-09-01
Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring
Grant 6,913,996 - Yamasaki , et al. July 5, 2
2005-07-05
Method of forming tungsten film
App 20050032364 - Okubo, Kazuya ;   et al.
2005-02-10
Method for depositing tungsten silicide film and method for preparing gate electrode/wiring
Grant 6,821,874 - Matsudo , et al. November 23, 2
2004-11-23
Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring
App 20030003729 - Yamasaki, Hideaki ;   et al.
2003-01-02
Laminated structure and a method of forming the same
App 20020058384 - Koizumi, Masato ;   et al.
2002-05-16
Method for depositing tungsten silicide film and method for preparing gate electrode/wiring
App 20010008796 - Matsudo, Masahiko ;   et al.
2001-07-19
Apparatus for forming laminated thin films or layers
Grant 6,251,188 - Hashimoto , et al. June 26, 2
2001-06-26
Method of forming tungsten silicide film
Grant 6,245,673 - Okubo , et al. June 12, 2
2001-06-12
Method and apparatus for forming laminated thin films or layers
Grant 6,022,586 - Hashimoto , et al. February 8, 2
2000-02-08

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed