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Patent applications and USPTO patent grants for Okoro; Chukwudi Azubuike.The latest application filed is for "hermetic metallized via with improved reliability".
Patent | Date |
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Hermetic Metallized Via With Improved Reliability App 20210407896 - Kanungo; Mandakini ;   et al. | 2021-12-30 |
Hermetic metallized via with improved reliability Grant 11,201,109 - Kanungo , et al. December 14, 2 | 2021-12-14 |
Hermetic fully-filled metallized through-hole vias Grant 11,171,094 - Mazumder , et al. November 9, 2 | 2021-11-09 |
Hermetic metallized via with improved reliability Grant 11,152,294 - Huang , et al. October 19, 2 | 2021-10-19 |
Glass Or Glass Ceramic Articles With Copper-metallized Through Holes And Processes For Making The Same App 20200270163 - Okoro; Chukwudi Azubuike | 2020-08-27 |
Hermetic Fully-filled Metallized Through-hole Vias App 20200251424 - Kind Code | 2020-08-06 |
Hermetic Metallized Via With Improved Reliability App 20200165160 - Kanungo; Mandakini ;   et al. | 2020-05-28 |
Hermetic Metallized Via With Improved Reliability App 20190313524 - Huang; Tian ;   et al. | 2019-10-10 |
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