Okita; Takanori
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okita; Takanori.The latest application filed is for "semiconductor device and manufacturing method therefor".
- Okita; Takanori - Kanagawa JP
- Okita; Takanori - Tokyo JP
| Patent | Date |
|---|---|
| Semiconductor device and manufacturing method therefor Grant 10,037,966 - Iwasaki , et al. July 31, 2 | 2018-07-31 |
| Semiconductor Device And Manufacturing Method Therefor App 20170092614 - IWASAKI; Toshihiro ; et al. | 2017-03-30 |
| Manufacturing method of semiconductor device Grant 8,975,119 - Kamachi , et al. March 10, 2 | 2015-03-10 |
| Ultrasonic wire bonding method for a semiconductor device Grant 8,569,163 - Sekihara , et al. October 29, 2 | 2013-10-29 |
| Manufacturing Method Of Semiconductor Device App 20130244381 - KAMACHI; Katsuhito ; et al. | 2013-09-19 |
| Ultrasonic Wire Bonding Method for a Semiconductor Device App 20120164795 - Sekihara; Masahiko ; et al. | 2012-06-28 |
| Semiconductor Device And Manufacturing Method Therefor App 20120098126 - IWASAKI; Toshihiro ; et al. | 2012-04-26 |
| Image pick-up inspection equipment and method Grant 7,627,241 - Okita , et al. December 1, 2 | 2009-12-01 |
| Apparatus And Method For Manufacturing Semiconductor Device App 20090127315 - OKITA; Takanori | 2009-05-21 |
| Image pick-up inspection equipment and method App 20060170911 - Okita; Takanori ; et al. | 2006-08-03 |
| Ultrasonic bonding apparatus and method App 20050194423 - Okita, Takanori | 2005-09-08 |
| Die bonding apparatus and method of die bonding with the apparatus App 20040121513 - Taguchi, Katsuhiro ; et al. | 2004-06-24 |
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