loadpatents
name:-0.0083761215209961
name:-0.020251989364624
name:-0.00064992904663086
Okinaka; Hideyuki Patent Filings

Okinaka; Hideyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Okinaka; Hideyuki.The latest application filed is for "resin material having non-ohmic properties, method for producing same, and non-ohmic resistor using said resin material".

Company Profile
0.17.6
  • Okinaka; Hideyuki - Hyogo JP
  • Okinaka; Hideyuki - Toyonaka JP
  • Okinaka; Hideyuki - Toyonaka-shi JP
  • Okinaka; Hideyuki - Osaka JP
  • Okinaka; Hideyuki - Setsu JA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resin material having non-OHMIC properties, method for producing same, and non-OHMIC resistor using said resin material
Grant 9,663,644 - Suzuki , et al. May 30, 2
2017-05-30
Resin Material Having Non-ohmic Properties, Method For Producing Same, And Non-ohmic Resistor Using Said Resin Material
App 20160177074 - Suzuki; Toshihiko ;   et al.
2016-06-23
Non-linear resistive element and manufacturing method thereof
Grant 8,896,409 - Okinaka , et al. November 25, 2
2014-11-25
Non-linear Resistive Element And Manufacturing Method Thereof
App 20130169405 - Okinaka; Hideyuki ;   et al.
2013-07-04
Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink
Grant 7,097,287 - Nakao , et al. August 29, 2
2006-08-29
Method of forming an electronic component using ink
Grant 6,979,416 - Nakao , et al. December 27, 2
2005-12-27
Ink jet device, ink jet ink, and method of manufacturing electronic component using the device and the ink
App 20040061747 - Nakao, Keiichi ;   et al.
2004-04-01
Method and apparatus for manufacturing sinter, method for measuring concentration of plasticizer, evaluation method, and evaluation apparatus
Grant 6,689,311 - Morita , et al. February 10, 2
2004-02-10
Method of forming an electronic component using ink
App 20030063155 - Nakao, Keiichi ;   et al.
2003-04-03
Method for manufacturing laminated-ceramic electronic components
Grant 6,485,591 - Nakao , et al. November 26, 2
2002-11-26
Method and apparatus for manufacturing sinter, method for measuring concentration of plasticizer, evaluation method, and evaluation apparatus
App 20020057980 - Morita, Kiyoyuki ;   et al.
2002-05-16
Electronic part and method for producing the same
Grant 6,118,647 - Okinaka , et al. September 12, 2
2000-09-12
Conductor paste and method of manufacturing a multilayered ceramic body using the paste
Grant 4,863,683 - Nakatani , et al. September 5, 1
1989-09-05
Electrooptic shutter array element
Grant 4,722,597 - Takubo , et al. February 2, 1
1988-02-02
Mold for press-molding glass elements
Grant 4,721,518 - Monji , et al. * January 26, 1
1988-01-26
Method of manufacturing a magnetic thin film
Grant 4,717,584 - Aoki , et al. January 5, 1
1988-01-05
Conductor paste and method of manufacturing a multilayered ceramic body using the paste
Grant 4,714,570 - Nakatani , et al. December 22, 1
1987-12-22
Mold for press-molding glass optical elements and a molding method using the same
Grant 4,685,948 - Kuribayashi , et al. August 11, 1
1987-08-11
Molding method for producing optical glass element
Grant 4,629,487 - Monji , et al. December 16, 1
1986-12-16
Mold for direct press molding of optical glass element
Grant 4,606,750 - Torii , et al. August 19, 1
1986-08-19
Reducing gas sensor
Grant 4,045,178 - Okinaka , et al. August 30, 1
1977-08-30

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