Okimoto; Rikiya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Okimoto; Rikiya.The latest application filed is for "circuit board, method for testing circuit board, and method for manufacturing circuit board".

Company Profile

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Okimoto; Rikiya - Osaka JP
Okimoto; Rikiya - Katano-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit Board, Method For Testing Circuit Board, And Method For Manufacturing Circuit Board App 20090202142 - Ishimaru; Yukihiro ; et al.	2009-08-13
Module Having Built-in Electronic Component And Method For Manufacturing Such Module App 20090115067 - Okimoto; Rikiya ; et al.	2009-05-07
Multi-layer Circuit Substrate Manufacturing Method And Multi-layer Circuit Substrate App 20090032285 - Ueda; Yoji ; et al.	2009-02-05
Electronic Component Module And Method Of Manufacturing The Same App 20080296053 - Ishimaru; Yukihiro ; et al.	2008-12-04
Electronic Component-containing Module And Manufacturing Method Thereof App 20080298023 - Okimoto; Rikiya ; et al.	2008-12-04
Test Mark Structure, Substrate Sheet Laminate, Multilayered Circuit Substrate, Method For Inspecting Lamination Matching Precision Of Multilayered Circuit Substrate, And Method For Designing Substrate Sheet Laminate App 20080186045 - UEDA; Yoji ; et al.	2008-08-07
Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment App 20080185178 - Okimoto; Rikiya ; et al.	2008-08-07
Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment App 20050124197 - Okimoto, Rikiya ; et al.	2005-06-09

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