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Patent applications and USPTO patent grants for Oki; Takeo.The latest application filed is for "printed wiring board and its manufacturing method".
Patent | Date |
---|---|
Printed wiring board and its manufacturing method Grant 8,065,794 - En , et al. November 29, 2 | 2011-11-29 |
Electroplating process of electroplating an elecrically conductive sustrate Grant 7,827,680 - En , et al. November 9, 2 | 2010-11-09 |
Printed wiring board and its manufacturing method Grant 7,691,189 - En , et al. April 6, 2 | 2010-04-06 |
Printed Wiring Board And Its Manufacturing Method App 20090145652 - En; Honchin ;   et al. | 2009-06-11 |
Printed Wiring Board And Its Manufacturing Method App 20070266886 - En; Honchin ;   et al. | 2007-11-22 |
Printed wiring board and its manufacturing method Grant 7,230,188 - En , et al. June 12, 2 | 2007-06-12 |
Method for producing a tin-zinc alloy film Grant 6,875,291 - Kanematsu , et al. April 5, 2 | 2005-04-05 |
Printed wiring board and its manufacturing method App 20040134682 - En, Honchin ;   et al. | 2004-07-15 |
Method for producing a tin-zinc alloy film Grant 6,709,719 - Kanematsu , et al. March 23, 2 | 2004-03-23 |
Method for producing a tin-nickel alloy film Grant 6,602,354 - Kanematsu , et al. August 5, 2 | 2003-08-05 |
Method for producing a tin-nickel alloy film Grant 6,527,881 - Kanematsu , et al. March 4, 2 | 2003-03-04 |
Method for producing a tin-zinc alloy film App 20030024613 - Kanematsu, Hideyuki ;   et al. | 2003-02-06 |
Method for producing a tin-zinc alloy film App 20030026913 - Kanematsu, Hideyuki ;   et al. | 2003-02-06 |
Method for producing a tin-nickel alloy film App 20020069943 - Kanematsu, Hideyuki ;   et al. | 2002-06-13 |
Method for producing a thin-nickel alloy film App 20020046787 - Kanematsu, Hideyuki ;   et al. | 2002-04-25 |
Coated abrasive grains and a manufacturing method therefor Grant 5,230,718 - Oki , et al. July 27, 1 | 1993-07-27 |
Opening and closing device for retractable nib fountain pen Grant 4,560,298 - Oki , et al. December 24, 1 | 1985-12-24 |
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