OKEYUI; Takuji

Patent Applications and Registrations

Patent applications and USPTO patent grants for OKEYUI; Takuji.The latest application filed is for "protecting film for blade of wind power generator".

Company Profile

0.14.20

OKEYUI; Takuji - Ibaraki-shi JP
Okeyui; Takuji - Ibaraki N/A JP
Okeyui; Takuji - Osaka JP
Okeyui; Takuji - Osaka-Fu JP
Okeyui, Takuji - Shinjuku-Ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Protecting Film For Blade Of Wind Power Generator App 20130243605 - WATANABE; Hiroyuki ; et al.	2013-09-19
Semiconductor device, substrate for producing semiconductor device and method of producing them Grant 8,525,351 - Ikenaga , et al. September 3, 2	2013-09-03
Semiconductor Device, Substrate for Producing Semiconductor Device and Method of Producing Them App 20110291303 - Ikenaga; Chikao ; et al.	2011-12-01
Semiconductor device, substrate for producing semiconductor device and method of producing them Grant 8,018,044 - Ikenaga , et al. September 13, 2	2011-09-13
Semiconductor device, substrate for producing semiconductor device and method of producing them Grant 7,943,427 - Ikenaga , et al. May 17, 2	2011-05-17
Protecting Film For Blade Of Wind Power Generator App 20110058950 - WATANABE; Hiroyuki ; et al.	2011-03-10
Reinforcing sheet for wind power generator blades, reinforcing structure of wind power generator blade, wind power generator, method for reinforcing the wind power generator blade App 20110031758 - Mitsuoka; Yoshiaki ; et al.	2011-02-10
Foam filling material for wind power generator blades, foam filling member for wind power generator blades, wind power generator blade, wind power generator, and method for producing the wind power generator blade App 20110031759 - Mitsuoka; Yoshiaki ; et al.	2011-02-10
Vibration damping sheet for wind power generator blades, vibration damping structure of wind power generator blade, wind power generator, and method for damping vibration of wind power generator blade App 20110031757 - Mitsuoka; Yoshiaki ; et al.	2011-02-10
Fuel cell Grant 7,862,954 - Yano , et al. January 4, 2	2011-01-04
Fuel Cell App 20090017354 - Yano; Masaya ; et al.	2009-01-15
Fuel Cell and Power Generating Method App 20080248338 - Yano; Masaya ; et al.	2008-10-09
Semiconductor device fabricating apparatus and semiconductor device fabricating method Grant 7,365,441 - Ikenaga , et al. April 29, 2	2008-04-29
Semiconductor Device, Substrate for Producing Semiconductor Device and Method of Producing Them App 20080048311 - Ikenaga; Chikao ; et al.	2008-02-28
Semiconductor Device, Substrate for Producing Semiconductor Device and Method of Producing Them App 20070241445 - Ikenaga; Chikao ; et al.	2007-10-18
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device Grant 7,262,514 - Yoshikawa , et al. August 28, 2	2007-08-28
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device Grant 7,235,888 - Hosokawa , et al. June 26, 2	2007-06-26
Adhesive film for manufacturing semiconductor device Grant 7,132,755 - Hosokawa , et al. November 7, 2	2006-11-07
Semiconductor device fabricating apparatus and semiconductor device fabricating method App 20060145363 - Ikenaga; Chikao ; et al.	2006-07-06
Semiconductor device fabricating apparatus and semiconductor device fabricating method Grant 7,064,011 - Ikenaga , et al. June 20, 2	2006-06-20
Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device App 20050253286 - Yoshikawa, Keisuke ; et al.	2005-11-17
Method for manufacturing Semiconductor device, adhesive sheet for use therein and semiconductor device App 20050133824 - Hosokawa, Kazuhito ; et al.	2005-06-23
Adhesive film for manufacturing semiconductor device App 20050133936 - Hosokawa, Kazuhito ; et al.	2005-06-23
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device Grant 6,858,473 - Hosokawa , et al. February 22, 2	2005-02-22
Thin metal layers-having ceramic green sheet and method for producing ceramic capacitor App 20050030696 - Ouchi, Kazuo ; et al.	2005-02-10
Semiconductor device fabricating apparatus and semiconductor device fabricating method App 20040164387 - Ikenaga, Chikao ; et al.	2004-08-26
Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device App 20040018659 - Hosokawa, Kazuhito ; et al.	2004-01-29
Metal transfer sheet, producing method thereof, and producing method of ceramic condenser App 20030219608 - Ishizaka, Hitoshi ; et al.	2003-11-27
Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board Grant 6,373,000 - Nakamura , et al. April 16, 2	2002-04-16
Multi-layer wiring board and method for manufacturing the same Grant 6,335,076 - Nakamura , et al. January 1, 2	2002-01-01
Process for the removal of resist material App 20010015259 - Toyoda, Eiji ; et al.	2001-08-23
Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board App 20010004944 - Nakamura, Kei ; et al.	2001-06-28
Process for the removal of resist material Grant 6,245,188 - Toyoda , et al. June 12, 2	2001-06-12

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